Corsair H70 (2010) cooler on LGA1150?

WDeranged

WDeranged

WDeranged

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11 Mar 2007
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I'm upgrading my i7 950 to a Devils Canyon setup and was wondering if I could keep my H70. If the hole spacing is different can I order a new mounting ring from Corsair?
 
Thanks for the replies. So the hole spacing of my i7 950 (1366) is the same as the i7 4790k (1150) ?

I remember the cooler coming with two mounting brackets but I think the other one was for AMD.
 
WDeranged said:
Thanks for the replies. So the hole spacing of my i7 950 (1366) is the same as the i7 4790k (1150) ?

I remember the cooler coming with two mounting brackets but I think the other one was for AMD.
Click to expand...

Yeah there are 2 brackets , one for Intel and AMD.
 
WDeranged said:
Thanks for the replies. So the hole spacing of my i7 950 (1366) is the same as the i7 4790k (1150) ?

I remember the cooler coming with two mounting brackets but I think the other one was for AMD.
Click to expand...
1366 has wider spacing, 1150, 1156 and 1155 all have the same mounting holes.
 
Ok so I did the upgrade but the backplate won't line up at all (only supports 775, 1156 & 1366), currently struggling with the stock Intel cooler until I can think of a solution.


This mounting kit is available for the H70 Rev 2 which supports sockets 1155/1156/1366/2011, looks like the all the notches for the pump are identical to mine so I'm really hoping this is the way to go.

1156-bracket-h50.png
 
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Ok now I'm confused, I got the mounting kit and it's identical to the one I already have. If 1155 has the same hole spacing as 1150 then this kit surely does not support it.

Does anyone have a clue where I should go from here?
 
Ah I was being a numpty, 1156 holes worked but I had to be very careful, the backplate doesn't sit exactly straight but it does indeed fit. The rest of the new mounting kit has been pretty well upgraded and has thick thumbscrews.

Temps aren't so great, [email protected] and I'm getting 80c with just the one fan, but it's not full blast and I might strap on the second fan to see what happens.
 
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Don't forget the newer CPU's are quite linear in one direction (usually top of mobo to bottom of mobo in a tower case IIRC - please check) - perhaps 50-60% taller than they are wide - so using the TIM "pea" method sometimes doesn't work well and often a "line" in the right direction will make more contact with the far ends of the core and cool better as a result.

The Broadwell desktop with the extra ram on the die is even more prone to this issue as the pea concentrates around where there arent any cores.
 
MDPlatts said:
Don't forget the newer CPU's are quite linear in one direction (usually top of mobo to bottom of mobo in a tower case IIRC - please check) - perhaps 50-60% taller than they are wide - so using the TIM "pea" method sometimes doesn't work well and often a "line" in the right direction will make more contact with the far ends of the core and cool better as a result.

The Broadwell desktop with the extra ram on the die is even more prone to this issue as the pea concentrates around where there arent any cores.
Click to expand...

Thanks for the info. I spread a very thin amount evenly over the chip surface and left a tiny bit of excess in the centre to be compressed. I was thinking it's worth a re-seat so I'll try the line method next.
 
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