6700k Delid - Conductonaut & Kryonaut - 26-35 degrees cooler!!

mediamatt

mediamatt

mediamatt

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Hi,

Wanting to delid a 6700k and also change the compound on a MSI 970 with a view to dragging every last drop of performance out of them both. Which thermal paste would be good for both?

Matt
 
Don't use paste on the die of the CPU, liquid metal. For the IHS to heatsink/block kryonaut is apparently one of the best. Using AS5 myself
 
Like said liquid metal would be best for CPU's heatspreader, because of limited surface area for heat conduction... Unless heatspreader sits very flush with die.
Of course you have to avoid messing liquid metal to wrong places because of its conductivity.
Though at least in some cases too much glue attaching heatspreader to CPU package has been quilty to high temperatures, by causing gap between silicon die and heatspreader.

For big surface area GPUs difference doesn't seem to be that dramatical.
https://www.tomshardware.com/reviews/thermal-paste-comparison,5108-11.html
And like said in that liquid metal pastes react badly if heatsink has something else than copper.
 
mediamatt said:
Hi,

Wanting to delid a 6700k and also change the compound on a MSI 970 with a view to dragging every last drop of performance out of them both. Which thermal paste would be good for both?

Matt
Click to expand...
Have you de-lidded?
Personally I would not use anything liquid metal. Of the top 35-40 TIMs it's the top 4-5 by a couple of degrees, and all the rest are withing 3c of each other when applied seated properly. Getting good heat transfer is more about getting a good seat and cooler mount than what TIM is used, but the better TIMs are usually easier to apply and get good sets with, so stick with one of them. GC Extreme, NT-H1, Hydronaut, Chill Factor III, MX-4, DC-1 are all within 1c of each other.
 
Most TIM is too thick to brush. I almost always use a small dot of TIM in center of IHS where CPU die/chip is and let mounting pressure spread it. When I remove cooler the TIM print is a circle on CPU IHS almost reaching edges. Keep in mind the IHS is not really a heat spreader but a support system to keep cooler/waterblock mounting pressure from flexing the CPU's PCB. The size of CPU is big because of the 1000+ connections between CPU and motherboard. Below is link to tutorial about TIM application, how a little is usually better than a lot, size if CPU die/chip under IHS, etc.
https://www.overclock.net/forum/22335323-post10.html

Here is link to TIM temp comparison done by Tom's Hardware & Overclocking Guide
https://www.overclock.net/forum/22646705-post13.html

Here is link to tutorial about airflow and optimizing case airflow so coolers get air at or near room ambient
https://forums.overclockers.co.uk/t...-i-put-my-temp-sensor.18564223/#post-26159770

It's pretty obvious the TIM used is not as important as how good the seat is and how well case supplies cooler with air at or near room temp.
 
Bought the delid tool today and asked for advice on a decent non liquid metal as didn't want to have issues with it being my first time. Was advised to get TG Aeronaut. Seems its the worst of the lot from reviews online. Might return it and get the Kryonaut or just go with the liquid metal and hope I don't brick it.
 
mediamatt said:
Bought the delid tool today and asked for advice on a decent non liquid metal as didn't want to have issues with it being my first time. Was advised to get TG Aeronaut. Seems its the worst of the lot from reviews online. Might return it and get the Kryonaut or just go with the liquid metal and hope I don't brick it.
Click to expand...

Applying anything other than liquid metal when delidding is a waste of time to be honest.
 
Argh .Ok .will take it back and get liquid metal for under the heatsink. Any recommendations on what to put between that and the cooler? Have arctic silber 5, mx4 and ic diamond here.
 
Although not sure it is worth it on a 6700k. In this heat (room temp was 24c) I played 4 hours of gaming yesterday evening and my case temp was 35c, my CPU never went over 64c and my GPU max was 54c. I`m happy with that. I understand OP is doing it to eke out performance tho.
 
Doing the delid later with TG Conductonaut under the heatsink and TG Kyronaut on top .Will take before and after temps with overclock to see how good or bad it is after .
 
Well..

Just done a test before i delid and got this..

Stock 4.0ghz and Stock Voltage Idle
kd5v2e.png


Stock 4.0ghz and Stock Voltage Prime 95 for 5 mins
23k7n2h.jpg


4.5ghz and 1.4v Idle
24ycr4l.png


4.5ghz and 1.4v Prime 95 for 2 mins...said 1 fatal error on prime
zixee9.png

zixee9.png


Now..

What i take from this is firstly the thermal paste musnt be applied properly as 1 core is almost half the temperature for ages and then creeps up to be close.. Is that right?
Secondly , my chip needs more than 1.4v for 4.5ghz so ive got a crap chip?

The ram is stock 2400mhz and XMP not enabled as that puts it to 2666mhz and wanted to isolate any ram issues with the overclock.

Thoughts?
 
Last edited:
Some cores run cooler/hotter due to the crappy TIM that Intel applied, it just is that way.

Also use Prime95 26.6 and test your overclock again
 
So between 26 and 35 degrees cooler on the 4.5ghz (i put the wrong pic in the 4.5/1.4v so corrected it in the post above.

The Thermaltake 240mm rad was covered in dust so cleaned that and did the delid and well chuffed.
 
The TIM under the IHS is just ludicrous!

Serious amount of TIM on the top of the cpu there lol

Awesome temps though
 
Shame your radiator was so dirty as that throws off your pre/post delid temperatures. Getting accurate data is a pain.

Still, massive improvement! What's your max temp now?
 
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