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On LGA 1700 it's very unlikely you'll get as good results from a line, or 5 dot method, verses manually spreading the paste. The IHS is just too big. Experts/champion overclockers such as der8auer use the manual spreading method, regardless of the paste used.
Video is old, though shows the method >
If you look through his 12th, 13th gen or Ryzen videos, you'll always see the paste has been manually spread over the IHS. He's using the thermal grizzly paste, but same is applicable for arctic silver, MX6, whichever paste.
You'll get armchair "experts" here saying otherwise, though be wary as they don't know as much as der8auer
There is no problem getting optimal spread on LGA1700 with a line, some CPUs like Threadripper can present a situation where a compromise is required due to the size of the IHS and spread out packages - for these pastes like certain Thermal Grizzly ones can be a benefit due to being designed with spreading in mind.
Der8auer generally uses TG pastes several of which are designed intentionally to be manually spread - some even have a applicator to aid spreading - one of the reasons people have had problems with TG pastes is because they ignore the application guide. Many common pastes like AS-5, MX series, etc. should not be applied the same way.
EDIT: Interesting the AS instructions say vertical line for Ryzens but doesn't look like they've updated the guide since Zen 1 (see for instance Ryzen 2600 delid).
I've done both spread and x with 4 dots (5800x3d) over couple of months and noticed no difference in temps with either
All that rroff is not really that interesting for most, most just wana put some on, stick the cooler on and go, long as it doesnt throttle etc most will be happy enough, not like u can screw it up that much. Only ppl interested in overclocking which isnt really that popular anymore would care about the little details.
Think it's over blown I'll stick to spreading unless can show me some data to back it up
Do NOT spread the line of thermal compound out.
When you place the heatsink on the top of the metal cap, the line of thermal compound will spread out like the pink oval pattern on top of the metal cap shown in photo QP4. Allowing the mounted heatsink to spread the thermal compound insures proper coverage, minimizes air bubbles and allows an optimum bond line between the two surfaces.
Well, I've gone as far as cpu,m.2,ram,motherboard,rear fan and aio radiator installation, but time to sleep now. I'm still none the wiser what to pick with all these varying methods, but I'm wondering if 3 thin vertical lines could work well for the 13900k? there's also a video on Youtube of Arctic themselves installing the AIO (and obviously they make the paste too) where the guy puts quite a thick DIAGONAL line across the IHS.. I've only seen that method in that video but can't find any results for doing it that way, so I'm intrigued about those two methods as alternatives.
Surely you go with the paste manufacturer's recommendation? Especially with a relatively large and established manufacturer like Arctic, i assume (perhaps naively) that in developing the paste, they (or their partners) test the efficacy under various conditions, using various application methods. All respect to youtube streamers and experts, but i imagine the manufacturers' testing is a lot more accurate, consistent and sophisticated.
Even though we recommend to spread the thermal paste evenly across the whole surface you can alternatively also draw a thin X across your chip. The mounting pressure will spread the thermal paste between the two surfaces. However, make sure not to use too much paste.
Hi chaps I’ve got some Artic MX-6 paste I intend to use on a new build I’m doing shortly, just wondering with the more rectangular shape of the Intel 13th gen what paste method works best.
I’m thinking of doing a pea or possible a smaller X in the centre. But a bit baffled some are pasting it over the whole thing or actually rubbing it all over with a finger.
A few YouTube vids are saying they’re all within 0.8c of each other, but wondering what you guys would recommend? Using it in conjunction with the Arctic Liquid Freezer II 360 cooler.
Cheers
35c odd in games ?
quality of paste doesnt matter, its all about quantity:Hi chaps I’ve got some Artic MX-6 paste I intend to use on a new build I’m doing shortly, just wondering with the more rectangular shape of the Intel 13th gen what paste method works best.
I’m thinking of doing a pea or possible a smaller X in the centre. But a bit baffled some are pasting it over the whole thing or actually rubbing it all over with a finger.
A few YouTube vids are saying they’re all within 0.8c of each other, but wondering what you guys would recommend? Using it in conjunction with the Arctic Liquid Freezer II 360 cooler.
Cheers