3770K Delidded, Lapped, Liquid Pro TIM. What a difference! (Lots of Pics!)

Okay, just done some more testing. Got the core voltage down to around 1.25v now for 4.5ghz.

Max temps in CoreTemp after running Prime95, Intel Burn Test, 3DMark11 (Extreme) and my own Lottery Simulator benchmark which I've been making in C#:

56, 56, 58, 52. Avg = 55.5. Pretty much exactly the same as 2 days ago.

Screenshot: Link

Sorry for the high res - it includes all 4 screens.

Also done 4 consecutive benchmarks in F1 2012... so it seems fairly stable all in all at these settings.
 
I delidded my 3570K the other day and used Liquid Ultra between the die and IHS, is there any difference other than the Ultra stuff is easier to remove? As I noticed you have used Liquid Pro, the first variation.
 
Thanks guys :)

Well, the lapping itself took perhaps 3 hours or so... but it's hard to say as I left part way through to see a customer and get some finer sandpaper.

It didn't feel like it took long, but all told I spent most of the day tinkering.

I was surprised about the Liquid Pro TIM though, I thought it would stick but when I opened the clamp the IHS literally fell off the CPU (the computer was half standing up at the time). Anything left was easily removed.

I'm not sure about the difference between Liquid Pro and Ultra... but I do remember seeing that the thermal conductive rating is different. Also the ultra is more of a paste I think, whilst the pro stuff looks like liquid solder, and is a bit tricky to spread.

I would say if you're looking into doing this and your temps are too high, then definately go for it if you think you have the motor skills, patience and are brave enough. It really isn't all that hard to do, as long as you are careful when getting the blade under the IHS to begin with. After that, I would DEFINATELY recommend using plastic to complete the process. Far far safer and very easy. Also remember to keep the blade flat, and only use a rigid non flexible blade (I used a stanley blade). I tried blunting one first, but I couldn't get it under the IHS, so it has to be sharp.
 
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If you are going to do this... I would recommend not bothering to lap the CPU/heatsink until you've had it working for a little while after delidding and changing the TIM. If it turns out you have any problems, then you might be able to still re-glue the IHS and send it back under warranty, before you permanently alter your chip.
 
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