Hello folks
I'm sure this general issue has come up many times, but I just wanted to get some more specific and recent opinions on this.
I have a new 5820K and I'm wondering what is the best technique for thermal paste application.
The old pea sized dot seems ever popular, but with the larger size of the Haswell-E's some seem to recommend the 'cross' pattern.
Then there are people who have delidded and think that the greater heat is going to be generated either side of the middle, so question the logic of a 'centre-based' application.
And there's that little hole - is there a danger of that getting covered with the paste?
Any help on this would be most appreciated!
Thanks.
I'm sure this general issue has come up many times, but I just wanted to get some more specific and recent opinions on this.
I have a new 5820K and I'm wondering what is the best technique for thermal paste application.
The old pea sized dot seems ever popular, but with the larger size of the Haswell-E's some seem to recommend the 'cross' pattern.
Then there are people who have delidded and think that the greater heat is going to be generated either side of the middle, so question the logic of a 'centre-based' application.
And there's that little hole - is there a danger of that getting covered with the paste?
Any help on this would be most appreciated!
Thanks.