5820K Thermal paste application...

antijoke · 20 Aug 2015 at 11:02

I have seen a couple that start with a pea sized amount then spread it with a card....

x method I assume is just do an x and then place the heatsink on it?

faheemrazzaq · 20 Aug 2015 at 11:06

anticonscience said:
I have seen a couple that start with a pea sized amount then spread it with a card....

x method I assume is just do an x and then place the heatsink on it?

for pea method also you just put the heatsink on top without spreading it with the card. I have been personally using it and have done dozens of applications this way without any issue. Whenever i take the cooler off, I can see evenly distributed paste on the complete cpu surface. Less is more. So make sure you don't apply too much.

tyler_jrb · 20 Aug 2015 at 11:19

I use the Pea method and let the heatsink spread it (about 5-6mm size), as it cures it will spread more due to heat. I generally use TIM that spreads well like EK ecotherm as I find that its even better than Arctic silver 5. Dont use Diamond 7 that stuffs like clay.

apostolis_kt · 23 Aug 2015 at 01:03

Same for me, pea and let heatink spread. I used to do the spread with card but i didnt notice any difference so i might as well not make a mess with the card and let the heatsink do the job for me.

Rikk82 · 23 Aug 2015 at 08:43

I always do the pea method as well and never had any issues with that.

mushtafa · 23 Aug 2015 at 08:47

Same as above, small pea sized blob, bolt the cooler down. Job done

Verponian · 23 Aug 2015 at 12:07

I've always used the pea sized blob before but decided to try a small X this time round.

It seems okay, running around 31-32 in the bios despite the heat the past few days. On the other hand I'd hope for good temps with my cooler and I've not actually done any oc-ing yet. I just can't shake the feeling I've used too much and have to keep resisting the urge to take it off and have a look. I'll see what the temps look like after I try to oc.

One thing I did this time round after the I botched the first application was to just hold the TIM syringe in my palm for about 30 seconds. It warmed up the MX-4 enough to get a nice, smooth and clean amount out and hopefully helped the initial spread too.

apostolis_kt · 23 Aug 2015 at 16:11

Verponian said:
I've always used the pea sized blob before but decided to try a small X this time round.

It seems okay, running around 31-32 in the bios despite the heat the past few days. On the other hand I'd hope for good temps with my cooler and I've not actually done any oc-ing yet. I just can't shake the feeling I've used too much and have to keep resisting the urge to take it off and have a look. I'll see what the temps look like after I try to oc.

One thing I did this time round after the I botched the first application was to just hold the TIM syringe in my palm for about 30 seconds. It warmed up the MX-4 enough to get a nice, smooth and clean amount out and hopefully helped the initial spread too.

I think those temps are really fine if you think about it the weather was warm and i dont think your house temp would have 0 temps...

Daytrader · 23 Aug 2015 at 16:17

I might start a new thread, 7 years ago was last time i built a pc and applied paste, i just used the spread with a card method, aint this the same as useing the pea blob in middle, and letting the heatsink spread it, as both ways spread the paste over the chip, at least with the credit card way you know you have spread it all over correctly, doing the blob pressure way, might not cover it correctly if you used to small amount, or if you use to much it goes all over the sides ? dont anyone still just use the spread method with card anymore ? oh and i have a skylake i7 6700K chip, and they look very small compared to other chips, would people still apply useing the same method ?

faheemrazzaq · 23 Aug 2015 at 16:23

Daytrader said:
I might start a new thread, 7 years ago was last time i built a pc and applied paste, i just used the spread with a card method, aint this the same as useing the pea blob in middle, and letting the heatsink spread it, as both ways spread the paste over the chip, at least with the credit card way you know you have spread it all over correctly, doing the blob pressure way, might not cover it correctly if you used to small amount, or if you use to much it goes all over the sides ? dont anyone still just use the spread method with card anymore ? oh and i have a skylake i7 6700K chip, and they look very small compared to other chips, would people still apply useing the same method ?

With card method you risk an uneven spread which may result in some air pockets and too much TIM between the cooler and CPU. Let heat sink spread it and it will result in a neater mess free job.

Daytrader · 23 Aug 2015 at 16:27

Ah ok, i guess i just need to judge how much paste to put on a 6700K then, i would just be worried that when i use heatsink to do the job, it might not spread over the whole surface.

faheemrazzaq · 23 Aug 2015 at 16:45

Daytrader said:
Ah ok, i guess i just need to judge how much paste to put on a 6700K then, i would just be worried that when i use heatsink to do the job, it might not spread over the whole surface.

As said before less is more. Watch a few videos where people used this method and you must be set to go.

Daytrader · 23 Aug 2015 at 16:57

I just watched this https://www.youtube.com/watch?v=nfDsDLlj_Uo, everyone says pea method, not sure what peas people are growing, but seems they put way to much on, and when useing line method or cross method, they put on the equivalent of 2 or 3 peas, still seems the credit card method is the best.

MasterOC · 23 Aug 2015 at 17:40

Acme said:
You do know how big a pea is right?

I think the paste is supposed to go on the chip, not around the outside of it!

tell that to Amd and Nvidias board partners !

Credit card method IMO is still king but far to much hassle for the amount of times blocks or heatsinks come off .

Pea is an exaduration but only to those who know nothing else . It's still about the best description of the method . I wouldn't know how else to put it actually .

Daytrader · 23 Aug 2015 at 17:44

Well i used credit card method on my 7 year build, and temps still the same to this day, think i will be useing that on my skylake 6700K

remember, we have all been useing it for like 20 years before with no problem

Orangey · 24 Aug 2015 at 10:10

Empty out a packet of Nerds on your work surface.

Pick out the biggest one.

That is the size.

grumpybeard · 15 Nov 2015 at 18:47

Just about to install a 5820k. Always used "grain of rice" (smaller than pea!) method in the paste. Still recommended way to go, as Ive seen some build logs using the X method.

setter · 15 Nov 2015 at 18:51

Went with the rice grain method on my 5820k. But may try a remount as a few cores are a bit high.

http://forums.overclockers.co.uk/showpost.php?p=28808658&postcount=1

Temps in spoiler links.

whyscotty · 15 Nov 2015 at 18:51

grumpybeard said:
Just about to install a 5820k.

Always used "grain of rice" (smaller than pea!) method in the paste.

This is what I use - never had issues

Hedge · 15 Nov 2015 at 19:32

I did my 5820k last week.

Used a small peasized splodge in middle of chip. Idles at 30c at 1.3v 4.5ghz.

Edit : infact I'd say more rice sized