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7700k delid results

You increase the gap between the IHS and the die if you re-seal it, simple as that. Unless you are shipping it why bother?

Your putting it back to how it was if you seal it. You don't put a massive blob of what ever you use. You can put it on the side if you wanted to it will be closer if anything.

Either way it won't kill the performance. If don't poorly it might not cools as well
 
Your performance will be worse if you re-seal it, end of story. It's not going to fall off when it's mounted so you don't need to do it.

You increase the gap between the IHS and the die if you re-seal it, simple as that. Unless you are shipping it why bother?

Sorry but that is a load of rubbish. This is liquid sealant that we are using so when it's applied to the inner edge of the IHS (not the lip that touches the pcb) and it's clamped down the IHS sits tight against the pcb. It doesn't increase the gap at all.
 
Most see this as a great result.
But it's not, it's actually really sad. (Not your efforts or work done). But it's so sad that we are now in a position where we HAVE to do this. And by doing it the gains are so big.
The bloody thing should be shipping with adequate TIM for a start! It really annoys me. The whole chip should be running 30 degrees cooler from the factory. or at least 20 degrees cooler.

The fact that we inadvertently celebrate now the having to remove the lid from a CPU because quite frankly it ships unfit for purpose. (K series should NOT ship with junk TIM).

Rant over.

To the OP. At least you now have the CPU you frankly should have got in the first place. Why not send Intel an invoice for your time? (joke).
 
I agree with you 100%. They charge a premium for the unlocked cpu's yet to make them run cool we are having to delid them and in doing so avoiding the warranty. It's a complete and utter disgrace yet there are still people who defend what they are doing and keep saying that Intel does not support overclocking. Why make unlocked cpu's then? it's a joke!!
 
Why put the HS back on at all if delidding? Surely you will get the best temps by putting the cooler (carefully) directly on the die.
 
Why put the HS back on at all if delidding? Surely you will get the best temps by putting the cooler (carefully) directly on the die.

Even with the naked Ivy mounting kit direct die cooling has worse temps than with the IHS back on. I am not the only one on here to have found this to be the case.


How would you re-seal it without increasing the gap at all? That's impossible. Obviously if you do it very well then there will be only a small difference but the best you can get is not to do it at all.

Have you ever seen the inside of a IHS? When relidding you don't put the sealant around the lip of the IHS you put it around the inner edge like I stated earlier. There is nothing between the lip and the PCB so the IHS is sitting flush with no gap at all. Have a look at this and maybe you will understand what I am saying. You see where the remnants of Intels sealant is on the inside of the lip of the IHS? That is where I put a very thin bead of sealant and none of it goes on the raised lip. This means that the IHS sits tight against the pcb with no gap at all. Why would anybody put sealant where Intel puts it around the lip of the IHS? That would make delidding it in the first place mostly pointless.
 
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That’s some really good results. My nephews 7700k runs hot and I would love to delid but it’s not worth it right now as he only uses it for games. Will definitely give it ago in a few years.
 
In theory going direct-to-die is better because you can conduct the heat from the heat source directly into the cooling mechanism without any intermediary steps. But in practice haven't we seen going direct just creates a hotspot in the cooler that hits a thermal capacity that can't be dissipated properly? Hence the use of a heat spreader to take the die's heat, spread it over a larger surface area and then the cooling plate has a better thermal capacity to "suck up" all the heat?
 
With regards to worse cooling when watercooling the die directly, I believe it's a combination of a lack of surface area compared to the IHS plus the design of the blocks are not for cooling such a small footprint. I am far from the only person to find direct die watercooling gives worse temps as several others on here had the same results. HardOCP found direct die cooling to be worse as well.

I just cannot bring myself to watch that video with that idiot carrying on with his inane drivel but did notice that it's the prototype N1 block which seems quite expensive for what it is plus has had mixed results so far. While it should cool better because direct die is what it's actually designed for, other tests have shown it to be no better or worse than a normal block. It will be interesting to see if the production version does any better but I wouldn't buy one.
 
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