Another TIM application question

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Hi,

Not sure whether to do like I normally do (small pea size blob) or follow the XSPC Raystorm manual and apply a thin layer obviously this is for their supplied TIM and not the IC Diamond I'm using. I have used the IC Diamond before and found it very stiff, so wondering if it would be best to spread a thin layer it rather than rely on the tension of the block to spread it.
 
If you can spread IC-D you are a better man than me (or it doesn't keep well). I tried to spread some to fill the heatpipe gaps on my Fenrir Evo last week and it was like trying to spread well chewed gum :o.

If you don't mind the work you could always do a test of you normal method and then remove it again and check the spread. Bit of hassle having to re-apply again afterwards but it would give you a reliable answer.
 
Just put a blob in the middle, the cooler will do the rest, never had any problems myself using this method.
 
Just going to use a blob but feels really tough it's about 18months old, would it be ok? Been a while since I used it so can't remember how stiff it was last time
 
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