Associate
In the past I have applied AS-5 using a razor blade to spread it thinly over the Processing Unit and then apply the heatink with a little twising back and forth to make sure it is bedded in.
I will soon have some more CPUs and GPUs to do and have bought some MX-3.
From what I have read the favoured approach nowdays is to apply a blob in the centre and then squish and twist it with the heatsink.
Whilst I understand some of the benefits of this approach I'm a little concerned how you know whether it has worked - covered properly.
For example, if you put a blob in the centre of a large square CPU and you squish it down, won't it naturally form a circle - if so either some of the chip will not have thermal compound or you will have compound squidging out.
What method do you use?
Cheers,
Nigel
I will soon have some more CPUs and GPUs to do and have bought some MX-3.
From what I have read the favoured approach nowdays is to apply a blob in the centre and then squish and twist it with the heatsink.
Whilst I understand some of the benefits of this approach I'm a little concerned how you know whether it has worked - covered properly.
For example, if you put a blob in the centre of a large square CPU and you squish it down, won't it naturally form a circle - if so either some of the chip will not have thermal compound or you will have compound squidging out.
What method do you use?
Cheers,
Nigel