Applying Thermal Compound

a line and then heatsink up and down around sideways w/e just get the thing covered :D
 
Remembring of course that it's purpose is only to fill the natural imperfections of the two conjoining surfaces. So too much could be detrimental regardless of how conductive the paste is.
 
Another one here, dont think I'll use the spread method anymore will use a blob in a middle with MX, doubt it makes much difference to temps anyway.

Good tune on this from around 2000 I think, forgot what its called lol.

Lemin said:
Cant find it now, but i seen a test, where they used Marmite & got same temps as AS5 !?!!
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I seem to remember Jokester using Toothpaste a few year ago on here lol. :p
 
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I came up with a new method today, it's worked really well. I put a big blob in the middle, like a pea size, then 4 little ones around that.

I got a tiny splurge all the way around the edge of the CPU/Cooler divide, and my temps are very very healthy. So must be good!
 
that video is silly. He either didn't use enough TIM or he put too much! And smiley method? wtf! A+ for oakenold though, one of my favourite songs of all time.

I just put a small rectangle sized amount in the middle, sort of a mini chode style line method, and swivel the block/hsf down... seems to work perfectly every time.
 
I have just fitted a GPU heatsink armed with this advice and in the end reverted to my tried and tested method.

The reason is that the heatsink as 4 threaded parts which protrude through the PCB so you can't twist the heatsink so I was a little worried about coverage using the 'centre pea' method.

So out came the razor blade to spread the thermal compound around and found that MX-3 doesn't spread very well at all - looks like the 'centre pea' approach is essential with MX-3.

So I reverted back to Arctic Silver 5 which by comparision spreads like a dream.

Cheers,

Nigel
 
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