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Applying thermal paste

stuscfc

stuscfc

stuscfc

Associate
Joined
3 Sep 2009
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97
Location
swansea
Hi i have previously built 2 pcs but never had to apply thermal paste to the cpu.The cpu is a Phenom11 tri core and the fan heatsink is the stock one circular underneath that came with the it. What would be the best method of applying the paste. Thanks Stu:)
 
Mostly I just apply a pea sized blob of TIM in the centre of the CPU and then apply the heatsink, the pressure of the heatsink will spread the TIM into place :)

(Edit: what paste are you using?)
 
Thats the way i was thinking.if i spread it all over the cpu it would be away from the heatsink base and no connection made. Thanks for the reply by the way.
 
Depends on the paste. If Arctic Silver 5 then their guide covers it all (different methods for different CPUs) & always works well for me.
 
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And on that note, if you are using Artic Silver 5 then be very careful not to get it on anything else like the motherboard as its conductive and can cause big problems :)
 
Typically a grain of rice amount of thermal paste!!!
It's not intended to be a sandwich filler. More of a microscopic polyfilla to level out all those microscopic uneven surfaces to give a bigger surface area and more contact between the heat sink and cpu to transfer heat more efficiently.
 
Think or stiff pastes like Gelid extreme would benefit from spreading but thinner ones will be just as effective or more with the blob or cross method, providing you dont apply too much.
 
stuscfc said:
Hi i have previously built 2 pcs but never had to apply thermal paste to the cpu.The cpu is a Phenom11 tri core and the fan heatsink is the stock one circular underneath that came with the it. What would be the best method of applying the paste. Thanks Stu:)
Click to expand...

5mm blob in the middle, spread it by screwing the heatsink evenly down on top of it. Don't take the HS off to check it after you apply, you'll likely introduce air bubbles.
 
On Socket 2011 because it's a fairly big chip, I normally put a line in the middle and work it around with my finger. On smaller sockets you can get away with just putting a line or blob and leaving it to spread out when pressure is applied. This is with MX-2. Slightly more liquid pastes might not need as much attention. It only need be a very thin layer, using much more can have adverse effects

Hey Jesus, if you're not going to be helpful at least try and be funny.
 
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If you spread it you'll get pockets of air as the heatsink is pressed down which will expand when hot, blob method is best it doesn't matter if you put a bit too much on it will just go over the edge - beats having pockets of air between the two contact areas.
 
Socket 2011 and previously normal Sandy and also AMD FX here.

Always used either IC 24c diamond (thick) or MX4 (thin). Also always used the small pea sized blob in the middle of the chip and let the cooler clamping pressure spread the paste. Never had issues with temps. Idles always in 20s. Load temps depend on whether watercooling or air.
 
I think most use the blob method, all of the thermal paste shootouts online seem to suggest a rice/pea sized blob and let the cooler spread it, if anything it's an easier and quicker method!
 
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