if you can get 1600 shaders on a 40nm core, you can easily be fitting 2400+ on a 32nm core, 28nm opens up the way for well, basically double shader power quite easily. However we're moving towards a new architecture rather than same old same old, though I don't really see base shader power increasing at a different rate at the moment.
As for bus, and things like the 4670 having 192mbit bus, well, it doesn't happen for cost. Which is partially the die size/complexity/signalling but its more the pcb cost. The more traces they more they cost, the thicker they'll need to be, the more expensive and longer they take to build and the more problematic things get.
You can take any card and say, well increase spec X Y or Z by 50% and it would be superb, of course it would, but it would likely kill off the use of a higher end salvaged part, which just loses them money.
If the 5770 was 192mbit bus, or even a 256mbit, not only would it cost more and perform way closer to a 5850, it would make a 5830 very hard to sell, because the difference in performance would be pretty small, yet the price to make for AMD/Sapphire of a 5830 is WAY higher than a 5770. If you can the 5830, then you have a lot of dead silicon that ends up not being sold, which is a waste and simply means the cost of production is spread across less cores, bad for us.
Rroff, theres not a chance in hell of 28nm from TSMC before the 4th quarter, because its TSMC frankly, what a CEO says publically when trying to secure orders for future parts, and whats really going on are different things. THe shell of the new fab is built, the inside is yet to be equipped, they probably won't start test runs for another 2-3 months, if, due to the same entirely stupid design as the 40nm process, the yields are utterly useless then we're months away from anyone wanting to make a real core on it.
From a TSMC perspective I can't see them producing much more than a "4770" type test product before the 4th quarter. Though its harder to call than normal as since Glo Fo started to take shape they've doubled their R&D spending, its very hard to judge when that money will kick in and effect things. Where they'd wait and not rush things at extra expense, they might do it now.
Glo Fo, well, I wouldn't be surprised if from this point on Glo Fo always have a higher yield, higher quality better working process than TSMC.
IN terms of production of graphics cards, the next 18 months will be very interesting to see who can keep up with who, and if either company is significantly behind on their process, will it utterly screw Nvidia or AMD. Thing is AMD can still use TSMC easily, Nvidia will be very reluctant to give a chunk of the profit from every core, to a company that owns 25% of AMD.