The only problem with putting too much on, is potentially making a mess - it doesn't affect performance. As long as you have 'enough' paste it doesn't matter.
We'll have to disagree on that one

I had previously thought that this true, and it was just a matter of excess waste/mess around the socket. So I put what I'd consider too much normally, and left it like that for 2 years.
Recently, I decided to treat the PC to a spring clean and repaste. Now baring in mind when I did the last paste, it was a brand new HSF, case, fans, so no dust anywhere - so a fair comparison.
So this time, I used less, but this time used the old school method that I'd used on Socket A's - using a credit card and smoothing it edge to edge all over, which ended up being pretty thin, compared to what the CPU and HSF looked like when I'd removed it to do this.
My temps went down 6-7C when gaming/benchmarking.
There definitely is a sweet spot, after all, thermal paste is meant to merely fill in microscopic cracks between the contact patch of the HS/IHS, so it does make sense that less is more.
I however, doubt there's any difference in the way you apply it, unless you are too stingy and say do an X and it misses out so parts, but that's rare - I only choose the credit card method, as I could see the coverage before mating the HS.
FWIW, I have had the same thing happen with a different CPU, that ran hotter, so this isn't just fluke.