****Fresh random image thread (with rule addition)Every post MUST contain an image!****

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I spent an hour redoing my thermal compound as it's been a year since install, it was rather thin to say the least!

That's a year of being on 24/7 only rebooting for updates/drivers btw :p

Before:
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After:
pc_annualclean_3.jpg


I'd be pretty miffed if anything happened to these:
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That's the normal method though! even thin layer, not too thick to not be able to see the IHS but not too thin that you see too much of it either!

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That's the normal method though!

The "normal" and advised method is a thin line from top to bottom or left to right depending on the chip and which way it's cores are, is it not?

Personally I use a pea size blob in the middle and always have.


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The "normal" and advised method is a thin line from top to bottom or left to right depending on the chip and which way it's cores are, is it not?

Personally I use a pea size blob in the middle and always have.

Aye various people have various methods but it all comes down to the same requirement, to spread as much paste over the surface as possible but not overflow it!

I've got to re apply it soon again anyway as I have some AS5 incoming (this was coolermaster paste and I am not a fan of it) so wil try the blob and note my temps.

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