Hello, I've got a nice shiny new DangerDen TYEE water block to go on an ATI X1900XT-X which I'm shortly about to order. However looking in the box, I see no heat pads for the memory pads, which I was expecting to ensure the memory sits in contact with the block.
The underside of the block comprises of two levels, a recessed area for the GPU, and a slightly raised (guestimate around 2mm raise) around the edge where I would expect the memory modules to sit.
Could anyone tell me please - has this block been machined such that its in contact with all the memory and GPU at the same time? I'm a bit concerned that all the chips on a reference design board are that accurately at the same level, such that without the extra mm or so a squishy heat pad give you ensures a contact. Should I play it safe and squash in some thermal pads (such as Akasa ShinEtsu Thermal Interface Pads Akasa ShinEtsu Thermal Interface Pads ? Or just use artic silver on the GPU and hope the memory sits sufficiently flush?
The underside of the block comprises of two levels, a recessed area for the GPU, and a slightly raised (guestimate around 2mm raise) around the edge where I would expect the memory modules to sit.
Could anyone tell me please - has this block been machined such that its in contact with all the memory and GPU at the same time? I'm a bit concerned that all the chips on a reference design board are that accurately at the same level, such that without the extra mm or so a squishy heat pad give you ensures a contact. Should I play it safe and squash in some thermal pads (such as Akasa ShinEtsu Thermal Interface Pads Akasa ShinEtsu Thermal Interface Pads ? Or just use artic silver on the GPU and hope the memory sits sufficiently flush?