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13c temp drop is definitely worth it
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HardOCP delid 7700K with OCUK tool
- Thread starter Quartz
- Start date
Soldato
The new delid tool wasn't out when they done that. I know it wasn't great but I am not sure time travel for a delid tool is something they should attempt to cover considering the rest of the article.
Soldato
Surely it wouldn't cost Intel much more than a few pennies per CPU to use decent TIM instead of the garbage they currently use ?
with AIO you won't see any differences in temp inside the case. the fans are pushing the heat out of the case so there is no heat gain or reduction inside the case given all other parameters being the same
they probably can't because the cost - vast quantity as well as the robots that squats the material will probably jam due to the viscosity of the better TIM.
but most likely down to cost.
if you look at the lid, it is not exactly a piece of engineering marvel either...a very basic machined piece of aluminium and chances are it is not a particularly good piece of aluminium...although that won't really affect how it performs thermally.
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- 12 May 2005
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The old IHS's were made of copper electroplated with tin, soldered on and the PCB was normal thickness.
Now we have cheap unknown paste, aluminium IHS, thin PCB's that make delidding riskier and even no free aircooler anymore. Cost cutting has gone too far.
WOW, there is no stock fan from the retail pack. that's just wrong! I guess their tick-tock model is taking its toll on their development costs. there aren't as many uptakes on broadwell...
looks like the tick-tock is becoming bodge-fix and now bodge-kinda fix-better fix...
I can understand why they want to commercialise every step of the development. but it really does go against the consumer market's expectation as everyone would be thinking something new is 6 month down the line that is better so why bother get this one right now. They will have a massive outlay on manufacturing that will not be fully recouped due to limited sales.
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Kaby Lake IHS is still nickel coated copper (otherwise everyone using CLU would have a nice fused/blackened IHS), and the package thickness is back to 1.1mm (just like Haswell) from Sky Lakes thin package.
Yeah though, the paste/gap (depending on your own theory) is pretty bad for thermals, although if they run at their advertised rate of 4.5 then it's not too bad.
And a faster CPU nets me more fps in CPU intensive games. Not massive amounts, but hey.
Yeah though, the paste/gap (depending on your own theory) is pretty bad for thermals, although if they run at their advertised rate of 4.5 then it's not too bad.
And a faster CPU nets me more fps in CPU intensive games. Not massive amounts, but hey.
Soldato
with AIO you won't see any differences in temp inside the case. the fans are pushing the heat out of the case so there is no heat gain or reduction inside the case given all other parameters being the same
What? someone was stating that the drop in temp is not important unless AIO as it will dump it in the case which they are suggesting will be a higher temp as the re-lidded unit would be more efficient.
All I stated was that he has no idea if the AIO or internal cooler is in use for the CPU. Your point is correct that you wont see the difference but that doesn't change the statement before either.
Note:
My argument to the original point on the other hand upon reflection is that;
If heat is being removed quicker/more efficiently thus the drop in temp then it would never get as warm to start with (the hot air at 80 degree was still being expelled prior to re-lidding the CPU) and now as it is moving heat faster at a lower temp (60 degree as an example) then the internal case temp would actually still be lower due to this not warmer.
I just needed a coffee to think about it
there is a reason my mug says "I will start to work when the coffee does" on it.
Soldato
It's all to do with being eco friendly. That's all it's ever been about. They need to show they're doing their bit.
Curlyriff;30456968 said:What? someone was stating that the drop in temp is not important unless AIO as it will dump it in the case which they are suggesting will be a higher temp as the re-lidded unit would be more efficient.
All I stated was that he has no idea if the AIO or internal cooler is in use for the CPU. Your point is correct that you wont see the difference but that doesn't change the statement before either.
Note:
My argument to the original point on the other hand upon reflection is that;
If heat is being removed quicker/more efficiently thus the drop in temp then it would never get as warm to start with (the hot air at 80 degree was still being expelled prior to re-lidding the CPU) and now as it is moving heat faster at a lower temp (60 degree as an example) then the internal case temp would actually still be lower due to this not warmer.
I just needed a coffee to think about it
the best way to look at it from a thermodynamic perspective is to see the whole system (the case) as a unit under air cooling. the energy input is the electricity and current draw. so given the all other components in this system being the same, with the CPU at a high Volt it will draw more energy.
the situation gets more complicated as the efficient of heat transfer between this system and ambient temperate is dependant on the efficiency of the cooling system at the various temperature differentials. i.e. if the case temp is say 40c and outside temp is 0c a fan based system will have say 50% efficiency in removing the heat, and if the outside is then 20c then that efficiency drops to 25% etc. and if the case temp is high it will be more efficient.
So assuming the same ambient temp. and this is when i assume that for a standard HSF based cooling with case fan based system, the heat increased due to the more efficient removal of heat from the CPU and thus heating the air in the case is not significant enough to cause a drastic increase in efficiency of the case fan. therefore effectively as a whole system the heat is increased as the result of the overclock. that's basically say while the cpu is cooler, but that removal of heat from CPU will result in heating up the air inside the case and the components which has A LOT more thermal mass and so on. so for every 40c drop in CPU temp you are probably heating up the case/gfc/air/ssd/hhd by 1c overall. You have to remember when using air cooling, the whole computer is effectively a heat sink. so as a system the overall energy is increased.
for an AIO system this is very different because the heating transfer system (the water block, coolant and radiator) is the close loop system. so you consider that as a system instead of the whole case. as the heat reject from the close loop system into the case itself is negligible. so a more efficient heat removal from the CPU in an AIO situation will result in better performance at no detriment of the system as very little of the heat energy from the CPU is transferred into the case and the components inside it. but ultimately doesn't make the case cooler.
I have actual done this with my PC. my case temp is always at 35c with or without overclocking.