Or if OP is brave, he could get some CLU. Which is very visual so you know you got a good fit before putting the block on. You spread out liquid metal with a brush and then put the block on. Just make sure you dont use too much so it overflows and shorts your mobo lol
High CPU temps :S @stock
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Soldato
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Id remount the block, also can you post a picture of your complete setup?
Air will rise so having the res above everything else will help, if this means giving the rig a slight tilt then so be it. I usually fill the res not much more than over the outlet, turn on, let it drain a bit, turn off then repeat till full. Sometimes i'll let it run for a minute or two between top ups towards the end which seems to help. Over time (few hours) you should get most, if not all of the air out leaving the res cap off.
I'd agree with not using the 'pea' method. I tend to go for a cross, apply pressure on the block, lift to check spread then re-apply if needed and job done.
How have you got your fans mounted and what speed are they running at?
I'd agree with not using the 'pea' method. I tend to go for a cross, apply pressure on the block, lift to check spread then re-apply if needed and job done.
How have you got your fans mounted and what speed are they running at?
"Engineer's Blue" is much, much safer. But you can achieve the same thing by using TIM even thin spread, seat cpu block (clean surface) then remove again, to check for any uneven spread. I highly doubt you will see any "high spots" though. No one laps their cpus to blocks any more (do they?).
As for OP, have you seen any reduction in temps at all? Are there less bubble than before or same?
Soldato
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Those bubbles are too small to be the cause for this. They aren't exactly helping though but they will go away in time by themselves. If you are having problems with paste, might be easier to spread the paste thinly using a card (this tends to be more effective with thick pastes as they dont spread very thinly from the blob method).
What was the spread of paste on the block after you removed it to re-apply?
The sponge is to put your pump on to remove vibrations, apart from that it isn't functional.
What was the spread of paste on the block after you removed it to re-apply?
The sponge is to put your pump on to remove vibrations, apart from that it isn't functional.
i have mounted the fans with under the rad exhausting air out of the case and im running them around 700rpm and i have tried faster but no effect
when i took it off, it was spreaded around 70%, i am using the Gelid GC extreme, im a right to say that this is one of the thick pastes ?
i have mounted the fans with under the rad exhausting air out of the case and im running them around 700rpm and i have tried faster but no effect
Better to have them blowing into the case, air temp outside will be colder than inside. Having them blowing air out is just exhausting hot air from inside the case through the rad.
700rpm may not be shifting a lot of air depending on the rating of the fans. IIRC slow fans are better on pull than push. I'd suggest maybe flipping them round and checking to see if that helps.
Soldato
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the amount is fine, it is just the stuff is too thick to spread by just putting pressure.
It use to come with EK blocks before they switched it out for the new stuff. It is a great paste but due to the thickness, blob method doesn't get good results. Use a card to spread it and you will find better temps.
Either use a credit card or even a freezer bag to spread it out, you'd be surprised how far you can go with it, its only to prevent air becoming trapped in the microscopic ridges in the metal surface.
There is also a great guide I found tonight about lapping your cpu surface here http://forums.extremeoverclocking.com/showthread.php?t=314766
Its an old guide and I'm not sure if its still applicable these days, does anyone still do this???
This also has a very good explanation about cpu and thermal pastes http://www.tomshardware.com/reviews/thermal-paste-heat-sink-heat-spreader,3600.html
There is also a great guide I found tonight about lapping your cpu surface here http://forums.extremeoverclocking.com/showthread.php?t=314766
Its an old guide and I'm not sure if its still applicable these days, does anyone still do this???
This also has a very good explanation about cpu and thermal pastes http://www.tomshardware.com/reviews/thermal-paste-heat-sink-heat-spreader,3600.html
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Thanks for the advice, I'll be buying some Arctic MX-2. Will this be easier to spread and I've also seen some people use the pea method but also using the block to spread it but they removed the block an made sure it was fully spreaded, is this a good idea?
if you do the pea method place block once. Don't lift again, if you lift it causes air bubbles when you place it back down and pretty much negates the point. All i do is put a pea and place the block down (trying to get it perfectly lined up in one go) then attach all screws starting at the 4 around the chip. once all are attached i tighten them up starting same method 4 around chip moving out. Not sure if i am doing it right but it's always worked 
. I use pea, cross and spread method (depends on how i am feeling at that moment in time) and to be honest if there is a difference it is only a few degrees nothing i would notice without testing before hand and afterwards.
. I use pea, cross and spread method (depends on how i am feeling at that moment in time) and to be honest if there is a difference it is only a few degrees nothing i would notice without testing before hand and afterwards.
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Soldato
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just building a system using mx2 as compound. I would say that you can do both methods. It isnt thick but it can be a bit stiff out the syringe sometimes.