How are contact frames not the norm for lga1700?

While +/- 1-2c is margin of error, when almost if not all installs with bracket verus those without run 2c or more lower temperature I think it's reasonable to believe bracket helps

I think it's pretty clear that it 's not "only manufactures with crappy tolerances", but all having better heat transfer / lower temps with brackets installed.

We can't see flex / deformity difference with naked eye. It would be extremely hard to measure / verify even with sophisticated instruments.

Data clearly indicates these brackets do help at least a little. Possibly more as time goes by, but only time might tell.
 
I'm another one that found it made no differences to my temps. Not that I was having issues anyway it's just nice to know for sure there wasn't a problem for me and it's a cheap enough part to give it a go.
 
While +/- 1-2c is margin of error, when almost if not all installs with bracket verus those without run 2c or more lower temperature I think it's reasonable to believe bracket helps
shows you can apply paste differently every time

I'm going to take a wild guess and say corsair is the most helped by the frame from seeing how flat their cold plate isn't on an a500, probably followed closely by arctic
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shows you can apply paste differently every time

I'm going to take a wild guess and say corsair is the most helped by the frame from seeing how flat their cold plate isn't on an a500, probably followed closely by arctic
It's not as simple as how flat base is or how flat IHS is.
Key is how well IHS and base mate up.

Until last couple years convex bases usually mated better to IHS than flat bases. But our much higher number of pins in sockets has moved us to much bigger sockets and thus bigger IHS. I know IHS stands for Integrated Heat Spreader but IHS size is directly related to socket size. IHS is slightly bigger than socket thus holding cooler base / waterblock in a fixed plane over top of socket.

When computer chips were in small area and pretty much centered in IHS convex cooler base / waterblock gave us good contact from computer chips thru IHS to base.
But now with bigger computer chips and bigger IHS the old convex base may or may not give a good match-up.

Poorly written, just hope it helps.

Edit:
In old days some of us would lap IHS and base to get better matchup. With these new smaller computer chips, bigger chip area, and bigger IHS are making lapping IHS and cooler base /waterblock even more important than it was in the past.
 
Not sure how much of a difference it made since I installed mine straight off the bat for my build. But I'm getting around 78c (room is about 20-21c) on my 12900k running at 5.2 all core at about 1.25V. This is whilst running a H264 encode which is heavy on the AVX.
 
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