You don't get a 15% IPC increase from Zen 1 to Zen 2 only by shrinking the die, the designs are fairly radically different.
Zen 2 is the same overall chiplet design with the same multi CCX design with the cores being "tweaked" versions of the Zen 1 cores with no "radical" redesign, as you say.
Shrinking the process allowed them to tweak the cores slightly (as I also said) but in no way are these tweaks a "radical" change between Zen 1 and Zen 2, it's just slight changes. If they hadn't shrunk the process to 7nm and instead stayed at 14nm they wouldn't have seen anywhere near a 15% IPC improvement so it's the combination of process shrink AND design tweaks which have made the impressive IPC change manageable.
Zen 3 will be the first "redesign" of the original Zen 1 as it moves to mono-CCX and we'll go through the same thing again with Zen 4 which will take the Zen 3 redesign and shrink the process once more with a few tweaks but no redesigns.
Of course we may just have different views on what a "radical" redesign means. For me it means things like moving from single Die to Chiplet or moving from multi-CCX to mono-CCX or moving to a completely new process like Intel changing from Nehalem to Sandybridge etc, that's what I consider to be "radically different" rather than slight cache tweaks, increased ITA, raising the number of entries in the Physical Entry File from 168 to 180 etc (plus a whole list of other similar tweaks) - all of which add up to IPC increases but aren't what I would consider to be "radical" changes.