Is it Samsung B.die

[8 Pack]

Remember guys there is actually two categories within b die at Samsung.

One is essentially binned the other is not. These you can estimate from spd. The binned ic is more expensive for the memory oem to buy from Samsung

Then often they perform there own internal sorting. I know team group obviously do because this is how the 8Pack IC is selected from the high Samsung bin and then too our credentials. C18 4k plus. We now have almost finished developing 5k c20. But obviously for this board and imc are also very important as well as the highest bin IC.

 

[Fyter]

Remember guys there is actually two categories within b die at Samsung.

One is essentially binned the other is not. These you can estimate from spd. The binned ic is more expensive for the memory oem to buy from Samsung

Then often they perform there own internal sorting. I know team group obviously do because this is how the 8Pack IC is selected from the high Samsung bin and then too our credentials. C18 4k plus. We now have almost finished developing 5k c20. But obviously for this board and imc are also very important as well as the highest bin IC.

Is this still the case? or do they have even higher bins than the previous high bins. There has been faster and tighter tuned ram beings release from g skill and team group recently. Will we notice any major binning improvement or are we paying for the higher xpm speeds?

 

[BallistixOnZ490]

Is this still the case? or do they have even higher bins than the previous high bins. There has been faster and tighter tuned ram beings release from g skill and team group recently. Will we notice any major binning improvement or are we paying for the higher xpm speeds?

Team Group and G Skill also further bin the chips that they get from Samsung, hence the 3800 CL14 and 4400 CL16 kits but they cost a lot.

This is also why fewer people are now able to reach 4000+ on cheaper kits, as with Micron E die. After binning for 4000+ kits, the chips that can't reach 4000 are used for the 3200-3600 kits. Most new 3600 CL16 1.35v should still manage tighter timings with higher volts, but are now unlikely to have much overclock headroom.

Not too long ago when the chips weren't being binned higher than 3200, is when you got loads of cases of 3200 modules like the ones I have reaching 4000+ with low latency, but that is very unlikely how that they are being binned.

 

[Fyter]

Team Group and G Skill also further bin the chips that they get from Samsung, hence the 3800 CL14 and 4400 CL16 kits but they cost a lot.

This is also why fewer people are now able to reach 4000+ on cheaper kits, as with Micron E die. After binning for 4000+ kits, the chips that can't reach 4000 are used for the 3200-3600 kits. Most new 3600 CL16 1.35v should still manage tighter timings with higher volts, but are now unlikely to have much overclock headroom.

Not too long ago when the chips weren't being binned higher than 3200, is when you got loads of cases of 3200 modules like the ones I have reaching 4000+ with low latency, but that is very unlikely how that they are being binned.

I see where you coming from and it makes sense.

Would you say there is a significant binning difference between 3200 cl14 and 3600 cl16 32gb 8 pac ram kits.

 

[BallistixOnZ490]

I see where you coming from and it makes sense.

Would you say there is a significant binning difference between 3200 cl14 and 3600 cl16 32gb 8 pac ram kits.

Performance improvements seem to scale more significantly up to 3600 CL14, but then start to flatten off with very minuscule gains after that. Plus for AMD theres no point going higher than what the infinity thing needs.

I remember seeing in benchmarks that its game dependant up to 3600, some games prefer frequency and others the timings.

From the current options, I'd prefer to get a kit rated for 3600 CL16 1.35v, and push the voltage to 1.45-1.5 for CL14, which should be doable on most Samsung B die or Micron E die kits. The problem with the latter is that users here have now reported that Micron are using any chips that can run those specs, so theres no guarantee of E die, so £180 for 3600 CL16 2x16 Samsung B die is currently the best option.

3800 CL14 and 4000+ any timing capable chips are all being handpicked and usually sold for more than they are worth, and generally after 3600 Mhz theres just an extra 1-2% performance boost per 400 Mhz and +1 CL rating.

 

[Fyter]

Performance improvements seem to scale more significantly up to 3600 CL14, but then start to flatten off with very minuscule gains after that. Plus for AMD theres no point going higher than what the infinity thing needs.

I remember seeing in benchmarks that its game dependant up to 3600, some games prefer frequency and others the timings.

From the current options, I'd prefer to get a kit rated for 3600 CL16 1.35v, and push the voltage to 1.45-1.5 for CL14, which should be doable on most Samsung B die or Micron E die kits. The problem with the latter is that users here have now reported that Micron are using any chips that can run those specs, so theres no guarantee of E die, so £180 for 3600 CL16 2x16 Samsung B die is currently the best option.

3800 CL14 and 4000+ any timing capable chips are all being handpicked and usually sold for more than they are worth, and generally after 3600 Mhz theres just an extra 1-2% performance boost per 400 Mhz and +1 CL rating.

Thanks for your thorough input, much appreciated. Its 199.99 for the 2x16gb 3600 mhz Cl 16 btw. The 2x16gb 3200 mhz Cl 14 is priced at 179.99. Based on those deals which would you go for in a build with 5900x/5950x tuned ram kit running on MSI B550 gaming edge WiFi.