It's been a while.

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It's been around 6 years since i last upgraded any components, Finally getting around to it, Still on Skylake!

Doing a complete build from the ground up with 11th Gen Intel. Is it still Standard practice to use Thermal in a DOT in the middle of the cpu? or has this changed to an X or Lines?.
 
It's been around 6 years since i last upgraded any components, Finally getting around to it, Still on Skylake!

Doing a complete build from the ground up with 11th Gen Intel. Is it still Standard practice to use Thermal in a DOT in the middle of the cpu? or has this changed to an X or Lines?.

Re thermal paste, there is no accepted way. As long as the paste connects your cooling solution to the CPU heatsink, then it's fine.

Just don't use too much, due to it leaking.

Myself, I use a credit card and spread it across the surface and remove excess.
 
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There is a very good video on YouTube and it's shows the different results with different methods.

Really interesting. Will try and find the link later.
 
So what your saying is, i've not to use the verge PC build as a guide?

Thank you, Glad to see nothing new has come out about pasting!

Be careful if you use liquid metal paste, if it leaks. I believe it is conductive. I assume you won't be using that though.
 
Be careful if you use liquid metal paste, if it leaks. I believe it is conductive. I assume you won't be using that though.


Arctic MX-4 2019 Edition Thermal Compound (4g)


There is a very good video on YouTube and it's shows the different results with different methods.

Really interesting. Will try and find the link later.


Appreciated
 
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