I am doing an essay type thing on how PCB is made, and I decided to talk about motherboards.
From what I understand, there is an insulated layer on top which is the bit that you see, then underneath is a routing layer, which routes the power to the components via copper wire in the layer. Underneath that is an insulative prepreg layer this insulates the power layer from the routing layer, exept that the points where the power is supposed to go. Then is the power layer, the big ol' copper layer where all the power travels through to give power to the routing layer (which is taken to the right place thanks to the prepreg layer).
Then you get another few insulating layers and you find the ground power layer, this is self-explanatory. Then you get some more insulating layers towards the bottom.
Have I got this right? The main area which I think I made mistakes is the bit about the prepreg allowing power from the power layer to be taken to the correct points on the routing layer. It's a bit technical, but if you know this, please let me know!
From what I understand, there is an insulated layer on top which is the bit that you see, then underneath is a routing layer, which routes the power to the components via copper wire in the layer. Underneath that is an insulative prepreg layer this insulates the power layer from the routing layer, exept that the points where the power is supposed to go. Then is the power layer, the big ol' copper layer where all the power travels through to give power to the routing layer (which is taken to the right place thanks to the prepreg layer).
Then you get another few insulating layers and you find the ground power layer, this is self-explanatory. Then you get some more insulating layers towards the bottom.
Have I got this right? The main area which I think I made mistakes is the bit about the prepreg allowing power from the power layer to be taken to the correct points on the routing layer. It's a bit technical, but if you know this, please let me know!