Megahalems instalation

Would guess that front to back is best as bottom to top is sucking heat generated by gpu to 'cool' the cpu . Then again who can say with certainty- best is to try and let us know :D

Am running push/pull front to back in a Haf 932 case - did look at bottom to top but decided against it because of above and possible lack of clearance. Got to say I'm happy with it as is although am considering 'losing' the pull fan.(Max extra loss in temp.is only 1c) so as to free up a bit of space and reduce elec.use.
 
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AgedIdiot said:
Would guess that front to back is best as bottom to top is sucking heat generated by gpu to 'cool' the cpu . Then again who can say with certainty- best is to try and let us know :D

Am running push/pull front to back in a Haf 932 case - did look at bottom to top but decided against it because of above and possible lack of clearance. Got to say I'm happy with it as is although am considering 'losing' the pull fan.(Max extra loss in temp.is only 1c) so as to free up a bit of space and reduce elec.use.
Click to expand...

The orientation of the heatsink should be such that the heatpipes are 90 degrees opposed to the length of the CPU die. This ensures that as much of the heatpipes as possible are directly above the die. The die runs lengthways down the motherboard so that the dies longer edge is parallel to the motherboards longer edge.

Some heatsink manufacturers claim up to 5 degrees C improvement in this orientation but there's no guarantee it will provide any improvement ;)

I've done a little diagram so you can see what I mean, the airflow from bottom-to-top airflow arrangement is on the left, the front-to-back airflow is on the right.

Light grey is the heatspreader, dark grey the CPU die, red lines are the heatpipes.


yDui5.png
 
Jotunkaiser said:
heat rises!
Click to expand...

Yes, but with a 120mm fan sitting on your cooler tower the effects of convection are not the strongest factor.

You're either drawing an amount of air over the bare PCB side of the top most gfx card, or you're drawing an amount of air through the drive bays and over the RAM (RAM gets pretty toasty too these days). Either way you are already raising the air above ambient temperature before it starts to cool your heatsink.

I am not suggesting you should use this orientation in every case; but if you have generally good airflow through your case, you should orient the heatsink the way it was designed to be placed, and that is with the heatpipes going across the CPU die.
 
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Cenuij said:
The orientation of the heatsink should be such that the heatpipes are 90 degrees opposed to the length of the CPU die. This ensures that as much of the heatpipes as possible are directly above the die. The die runs lengthways down the motherboard so that the dies longer edge is parallel to the motherboards longer edge.

Some heatsink manufacturers claim up to 5 degrees C improvement in this orientation but there's no guarantee it will provide any improvement ;)

I've done a little diagram so you can see what I mean, the airflow from bottom-to-top airflow arrangement is on the left, the front-to-back airflow is on the right.

Light grey is the heatspreader, dark grey the CPU die, red lines are the heatpipes.


yDui5.png
Click to expand...

Thanks - much appreciated imfo.:)
 
ok i turned the Prolimatech Megahalem round to face
front to back dual fans and temps droped 6 deg

i7 920 1.14v @3.6 went from 64deg under load prime 95 to 58 deg

cheers Cenuij..........
 
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