Soldato
It seems AMD has announced mobile Vega:
https://videocardz.com/74712/amd-finally-announces-discrete-mobile-radeon-vega
Also at around the same time Intel finally released more information and some benchmarks of the new 65W TDP SKUs which have AMD GPUs with 24 CUs and 4GB of HBM2:
https://videocardz.com/74640/intel-8th-gen-core-with-radeon-rx-vega-gpu-presentation-leaked
https://videocardz.com/74631/intel-launches-8th-gen-core-processor-with-radeon-rx-vega-graphics
Interestingly enough Intel has said the top SKU is a tad faster than a GTX1060 Max-Q.
Whats the chance they are both basically the same part - what are the chances this will replace the current Polaris based SKUs this year??
Or do people think it will only stay for mobile usage??
Edit!!
https://hexus.net/tech/news/graphics/113903-amd-details-2018-plans-radeon-gpus/
So,does that mean they have access to Intel packaging technology too??
https://videocardz.com/74712/amd-finally-announces-discrete-mobile-radeon-vega
Also at around the same time Intel finally released more information and some benchmarks of the new 65W TDP SKUs which have AMD GPUs with 24 CUs and 4GB of HBM2:
https://videocardz.com/74640/intel-8th-gen-core-with-radeon-rx-vega-gpu-presentation-leaked
https://videocardz.com/74631/intel-launches-8th-gen-core-processor-with-radeon-rx-vega-graphics
Interestingly enough Intel has said the top SKU is a tad faster than a GTX1060 Max-Q.
Whats the chance they are both basically the same part - what are the chances this will replace the current Polaris based SKUs this year??
Or do people think it will only stay for mobile usage??
Edit!!
https://hexus.net/tech/news/graphics/113903-amd-details-2018-plans-radeon-gpus/
It is likely that a variant of that GPU will find itself as the guts of the Radeon Vega mobile discrete GPU line-up, though other than mentioning the impressive 1.7mm package z-height and HBM2 memory usage (which is the same as the Intel SKU), no details were given with respect to specifications, performance, and release date.
So,does that mean they have access to Intel packaging technology too??