How are you spreading TIM? I use MX3 with a blob in the middle and press the sink down and turn it a little side to side to mash it in before i secure the sink. Spread pattern is quite good as well when i remove the heatsink.
I use the rice size blob method - and adjust accordingly with exposed heatpipes.
Although, i didn't use the blob method with the silver arrow (regretted it as soon as i tightened the last screw) - as the instructions were insistent on applying both surfaces with a thin layer. And as the surface of the HS was quite convex i erred on the side of caution. So i tinted both surfaces - and i think i may have used too little - although my temps are great.
Having said that, when i use the blob method i don't twist from side to side. I just plonk the HS on and allow for heat and pressure to spread the gunk - so i may try that when i next refit the SA. If my results are any different (as in the anomaly) i'll post back.
I use whichever paste comes to hand - AS5, MX2/3 or ChillFactor III - TBH, i'm not overly fussy with gunk. I've not noticed any major differences between 'quality' gunks - and if i do i put it down to a better contact between HS and CPU, that time around.
There may be a chance that the 2 SB chips, which had similar anomalies, may have been from the same batch as they were both ordered within the same period, from the same retailer. Plus there were a few threads with simialr issues around the same time - so it may have been a batch issue.
But, you seem to have way more experience when it comes to 'quantity of builds' (even though i've been building rigs since the early 90's for myself/family/friends) so i'll happily take onboard any fitting tips you have as you've probably 'been there and done that' a lot more times than myself.
I do builds in bursts - because i'm a bit like Bagpuss (if you know what that is?) - when i upgrade; suddenly all my friends and family want to upgrade too :/