Hi there,
Got some questions about lapping...
Not in any hurry to do it right away. I've read plenty of articles about lapping but they don't specifically mention certain considerations.
My plan: I plan to remove the IHS from the die before lapping. And after lapping then apply CLU to both sides of the IHS inside and out. So that CLU will be the only TIM used throughout. I have already checked my CPU heatsink base is a copper one and not aluminium.
Questions:
* My sandpaper has arrived in the post with a few creases in it. None are full sharp creases. It is more like 7-8 of mild crinklies spread around all over.
So will such a surface un-even ness really matter once it's been taped onto a pane of glass? (to get the flatness). And once the object is pressed down against the surface? I ask because most of the lapping tutorials say 'just use hand weight', and 'don't press down too hard'.
* is there any good trick / solution how to sand the inside of the IHS, given that it is recessed and difficult to access? The same method cannot be used as for the outside.
* My CPU heatsink is supposed to weigh 420g. Can I use the same technique as the IHS topside? Meaning is it too heavy for that? Moving the object around on stationary / fixed sandpaper surface as the base. No lapping tutorials really seem to show of discuss the matter at any great length.
* Can leaving a slightly rough surface on the copper help increase the total surface contact area vs mirror finish. Thus enhancing the thermal performance / heat transfer? Is there any articles somewhere about that? What is the correct grit to stop at to achieve the correct scale peaks / valleys? In particular for CLU TIM.
My sandpapers are 600,800,1000,1500,2000,2500 grit. One of each, size 28cm x 23cm.
Got some questions about lapping...
Not in any hurry to do it right away. I've read plenty of articles about lapping but they don't specifically mention certain considerations.
My plan: I plan to remove the IHS from the die before lapping. And after lapping then apply CLU to both sides of the IHS inside and out. So that CLU will be the only TIM used throughout. I have already checked my CPU heatsink base is a copper one and not aluminium.
Questions:
* My sandpaper has arrived in the post with a few creases in it. None are full sharp creases. It is more like 7-8 of mild crinklies spread around all over.
So will such a surface un-even ness really matter once it's been taped onto a pane of glass? (to get the flatness). And once the object is pressed down against the surface? I ask because most of the lapping tutorials say 'just use hand weight', and 'don't press down too hard'.
* is there any good trick / solution how to sand the inside of the IHS, given that it is recessed and difficult to access? The same method cannot be used as for the outside.
* My CPU heatsink is supposed to weigh 420g. Can I use the same technique as the IHS topside? Meaning is it too heavy for that? Moving the object around on stationary / fixed sandpaper surface as the base. No lapping tutorials really seem to show of discuss the matter at any great length.
* Can leaving a slightly rough surface on the copper help increase the total surface contact area vs mirror finish. Thus enhancing the thermal performance / heat transfer? Is there any articles somewhere about that? What is the correct grit to stop at to achieve the correct scale peaks / valleys? In particular for CLU TIM.
My sandpapers are 600,800,1000,1500,2000,2500 grit. One of each, size 28cm x 23cm.