Quick (maybe stupid) C2D Cooler question :)

GreenMint

GreenMint

GreenMint

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Hey all, silly question i know, really not sure though :(

My E6300 is idling at 44 (43Core 0 45 Core1) with the Ac7 and its stock thermal pads, yep, i know, bad idea to have used them, while i know its hardly massively overheating or anything i would like to get it down to a more humane 35ish idle, my question (Sorry for babbling) is when i have cleaned up the AC7 & the chip, and of course, removed the chip to a safe place for the cleaning, how do i go about it with the AC7? MY previous chips have all ben exposed cores, so i knew what i was doing there, AS5 gently over the whole core in a thin layer, but heatspreaders are new to me being an old AMD guy! :D (My 3500 system in sig was built by a friend) So i wasn't sure if i'm needing to coat the whole heatspreader gently or not? Some site said something about "in a thin line over the cores" but i'm not 100% sure and don't really want to be unplugging everything and lugging it all out again cause i did it wrong :D

Thanks, and sorry for the simpleton questions :)

Tim
 
Clean both the CPU and the heatsink off gently with some isopropyl alcohol. Then When you're done get the TIM and place a pea-sized dollup on the center of the CPU's heatspreader. Carefully position and install the heatsink. The pressure between the two of them will spread the TIM material.
 
I also read that putting some on the bottom of the heatsink then rubbing it off (not cleaning it) also aids things a bit by filling some of the unevenness on the bottom of the heatsink. I then do the "grain of rice" in the middle of the chip.
But thermal paste application seems to be an individual art :D
 
tinners said:
I also read that putting some on the bottom of the heatsink then rubbing it off (not cleaning it) also aids things a bit by filling some of the unevenness on the bottom of the heatsink. I then do the "grain of rice" in the middle of the chip.
But thermal paste application seems to be an individual art :D
Click to expand...
That's kinda what I do, just makes sure that there's no bald patches on either the CPU or the part of the HSF that's going to make direct contact with it but keep the layers thin!
 
BillytheImpaler said:
place a pea-sized dollup on the center of the CPU's heatspreader. Carefully position and install the heatsink. The pressure between the two of them will spread the TIM material.
Click to expand...
Depends how big your pea's are i spose, i use a grain size blob in the middle and let the pressure spread it out, my temps are very good for a e6300 at 3.3ghz.
 
Cob said:
For the C2D's, Arctic Silver themselves recommend a thin line from top to bottom and letting the heatsink spread it out.

The instructions (pdf file)
Click to expand...

Hmm interesting read. Think I may reapply and see if I can get the temps down a wee bit more. Also not heard about giving it several thermal cycles to get it working at its best. I always apply the stuff and then my PC will be left on for years. Wonder if it does make much difference.
 
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