Soldato
- Joined
- 15 May 2012
- Posts
- 5,945
- Location
- Louth, lincs
It seems as though Intel are using rubbish TIM between the IHS and die again, an 18c drop in temps once the delid procedure has been performed, click HERE for more details.
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.also using new much thinner PCB so vice only and maybe hammer and vice are not an option anymore...

.also using new much thinner PCB so vice only and maybe hammer and vice are not an option anymore...

I don't know why they just don't ship them without a lid. Since it's clearly hindering performance.
People will crush the die.
Pentium IIIs were shipped with no IHS, but the die wasn't fragile.
People will crush the die.
Pentium IIIs were shipped with no IHS, but the die wasn't fragile.
Exactly this, rma knightmare! Not sure why they dont solder all chips and just charge £5-10 extra and i'm sure people won't mind that??
intel should team up with coolaboratory liquid pro
put that in from manufacture instead

this de-lid on skylake seems to be very easy, there are no surface mount transistors/resistors/diodes to risk getting lopped off, so its a minimal risk job.
will be worth doing.
Really? Running a 6700k just now with a H100i GTX cooler, really happy with it all but would love to see how far I could push this - but I've never delidded before. Is there any good guides, I know what to do but just never done it before and dont want to make any mistakes - as at £320 a pop it's not exactly cheap.
I have an old chip QX6850 that's been sitting unused in a broken system. Could practice on that? Or is it soldered?
I have an old chip QX6850 that's been sitting unused in a broken system. Could practice on that? Or is it soldered?