- Joined
- 9 Nov 2009
- Posts
- 25,345
- Location
- Planet Earth
I see what you mean OP, but at the end of the day, isn't the proof "in the pudding" so to speak?
i.e Surely it's fairer to judge this system on how it actually performs, rather than rant about how it looks?
Even,at stock speeds some of the recent Shuttle motherboards have had issues and IMHO this more down to cost cutting.
Parts of the VRM circuitry in many Shuttle PCs run very hot and this has lead to premature failure of VRM capacitors in 2 to 3 years. Even the northbridge does run very hot in many cases too.
However,not cooling the critical parts of the Shuttle motherboard is not a good idea as people tend to use normal desktop components in the motherboards. The SX58J3 has a socket 1366 motherboard for example which uses 125W~ 130W TDP Core i7 processors. Many of these systems are run overclocked too.
Using steel for an SFF PC which is made for portability is nothing but cost cutting especially when it costs the same as the system it replaced. If the launch prices with new chipsets were much lower then it would be understanadble(not EOL pricing though).
Even Shuttle has realised its mistake and is shifting back to aluminum for its cases it seems. It also appears that they have also enhanced the VRM and northbridge cooling for their new socket 1366 motherboards too.
At least with the soon to be released H67 Shuttle motherboards which do not support overclocking and have a 95W limit you can get away with less cooling.
The fact is that I am a Shuttle fan but TBH, I really think that they should switch to making cases and their associated PSUs and leave the motherboards to other companies. It would make the company more competitive as they take ages to launch new motherboards with new chipsets,are cutting costs and of course they have their buggy BIOS too.
Last edited: