Thermal compound application- Newbie.

Im going to just use what artic silver suggests for a intel quad ivy bridge 3770k 3rd gen, The line down the midle and i may add two tiny dots ither side. That hopefully will be ok.
 
personally, i always have, and always will use the spread method. I have bought PC's from people and from retailers before (custom machines/bundles) and when i remove the heatsink the shape of the TIM gives away that most people use the dot method, probably because its quicker, but from what i've seen the coverage is far from good.

Thats my own personal experience and i doubt that there is a large difference in what the two methods actually do to be honest, its 90% down to personal preference.
 
cs2000 said:
personally, i always have, and always will use the spread method. I have bought PC's from people and from retailers before (custom machines/bundles) and when i remove the heatsink the shape of the TIM gives away that most people use the dot method, probably because its quicker, but from what i've seen the coverage is far from good.

Thats my own personal experience and i doubt that there is a large difference in what the two methods actually do to be honest, its 90% down to personal preference.
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When I use a dot (not too little, not too much) the cpu is completely covered and there's a nice square cpu shape on heatsink.

I did the spread method for the first time applying my zalman vf3000f cooler to gtx 570 as the IHS is very big and paste thick, and it got a bit messy with some paste squeezing out, never had that happen before.

Dot is definitely the best if you use the right amount.
 
I think you guys are forgetting just how thick as5 is. i dont think it will spread that well even under weight im just going to do as as5 says on there site for my processor and maby two TINY dots ither side of the line
 
Fair enough, whatever makes you happy ^^. I have 2 half empty syringes of AS5 that I haven't used for about 6 years since I found non electrically conductive pastes that perform just as well, spread better meaning you use less, have no curing time, and don't have to be reapplied for up to 8 years.
 
BrianB said:
Fair enough, whatever makes you happy ^^. I have 2 half empty syringes of AS5 that I haven't used for about 6 years since I found non electrically conductive pastes that perform just as well, spread better meaning you use less, have no curing time, and don't have to be reapplied for up to 8 years.
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Hey i am a first time builder and i just had a look at my cpu and i did not relise how small it was mother of god! think i may as well just use the pea size method, i have used as5 before but never achully took into considerration the shear size of the thing its tiny LOL **** it YOLO pea ftw
 
Remember the die itself is even smaller. The TIM only really needs to cover a small round circle, as long as temps are good you've done it right! If you think the cpu is small you should get some samsung green 30nm ram lol.

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BrianB said:
Remember the die itself is even smaller. The TIM only really needs to cover a small round circle, as long as temps are good you've done it right! If you think the cpu is small you should get some samsung green 30nm ram lol.

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Well then now im doing the line method again and this time im not chaning you suggest it my friend suggests it artic silver suggests it for quad core so thats what im doing no more messign about im aming for about 35c-38c idle
 
Actually I suggest the pea method, but either will work just fine, I'm just tight and don't want to use a whole line when I can use a small pea size. Good luck, remember to squeeze the syringe gently haha. I used small pea and idle at 34 today 3570k at 4.5GHz load is about 69c on D-14 cooler. :)
 
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