I will be installing a 3700X and Artic Freezer II 240 AIO this weekend.
It used to be a thin, evenly spread layer of thermal compound was the way to go but should I just use a dollop in the middle of the CPU now and allow the cooler to spread it automatically when its positioned on the CPU?
It used to be a thin, evenly spread layer of thermal compound was the way to go but should I just use a dollop in the middle of the CPU now and allow the cooler to spread it automatically when its positioned on the CPU?