Thermal compound on Ryzen CPU

I just got some of the cooler master cryofuze 14wlk stuff, as I was installing a new water block on my chip I had to get the board out to remove the old one, although its was a long winded job, I was grateful for it, cooler master say to use the spread method with this stuff, they even include a spatula for the job, and any paste that includes a spatula expect you to spread it, and boy is it thick and gloopy, made it much easier to do with the board out and flat on my desk.

With any Ryzen chip I would never use the pea method anyway, the CCD's are one side of the CPU and the IO die is slightly off centre the other side, the pea method was fine when chips had the cores in the middle under the IHS, but its not like that anymore and theres no guarantee of getting full coverage from edge to edge with the pea method, and it needs to be edge to edge to guarantee full heat dissipation, ive always just spread it with Ryzen's.
 
gjbf1 said:
Just got my 7800X3D. X method best on these then?
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I would definitely use the spread method on that chip, just like I did on my 7900, you dont want the paste pouring over the edges onto the little IC's in the crevices, they even make plastic covers which you can put over your chip to prevent this happening, or I think its thermalright who make a whole new socket cover to prevent this.

EDIT:

Yup, they do, its called: Thermalright ASF-RED AM5 CPU Holder.......Google it.

These are the little plastic covers: Noctua NA-TPG1 https://noctua.at/en/na-stpg1

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Jamin280672 said:
I would definitely use the spread method on that chip, just like I did on my 7900, you dont want the paste pouring over the edges onto the little IC's in the crevices, they even make plastic covers which you can put over your chip to prevent this happening, or I think its thermalright who make a whole new socket cover to prevent this.

EDIT:

Yup, they do, its called: Thermalright ASF-RED AM5 CPU Holder.......Google it.

These are the little plastic covers: Noctua NA-TPG1 https://noctua.at/en/na-stpg1

​

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Click to expand...

I might get that socket cover. Thanks.

The spreader method seems like it has its own issues though? If it's too thick it'll leak too, plus air and contaminants getting in.
 
gjbf1 said:
I might get that socket cover. Thanks.

The spreader method seems like it has its own issues though? If it's too thick it'll leak too, plus air and contaminants getting in.
Click to expand...

TBH, as I said in a ealier post, if they provide a spatula, then they probably expect you to spread it, however in all these tests, its maybe 1 or 2 degree's difference between all methods, I wouldnt let that bother me, you can always put it in the microwave for a few seconds or a cup of hot water for 5 mins to soften it up a bit to make it easier to spread, ive done that more than once.

take this for instance which is the one I brought, I brought the grey though which has a higher wlk than the violet, this is Coolermasters video.

 
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Most pastes have an official application guide, though I will caveat that often they recommend the method people will least likely screw up rather than necessarily the optimal method.

Some pastes like some of the TG ones come with an applicator and expressly tell you to spread - those kind of pastes tend to be better for use on large surface area IHS, etc. other pastes will tell you specifically not to spread and/or only to spread on certain types of use. A lot of pastes have been tweaked to be more tolerant of different methods because of people persisting with the "wrong" method(s) though in recent years - but incorrect application can result in both a decrease in performance and a shorter lifespan before it needs redoing.

I remember years back a forum poster who persisted in spreading using cling film and then wondering repeatedly why they were needing to re-paste after less than a year when that paste specifically said not to hand spread :s and they never seemed to be able to join the dots.

EDIT: Also if you are going to go off the official guide method then you really need to know the layout underneath the IHS as alluded to above - many Intel CPUs benefit from a line while Ryzens generally don't.
 
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