Nah, not right. The heat sinks for these NVMe are usually just a flat plate. That doesn’t add any extra surface area or do anything. So it is better to just leave the chips exposed to air and let it cool as opposed to add another layer.
basically each layer you add on you are adding resistance for the heat to be transferred out into air. That’s why by delidding CPU and cool the die directly you get better temps.
same principal here blowing cold air into the chips directly without these flat plate heat sinks and even worse these thermal pads is way better solution. Just don’t look as good.