Thermal Paste Application

hildark7 · 2 Dec 2011 at 00:39

my new kit comes tomorrow and im trying to find out the best way to apply my IC Diamond thermal compound?

does it matter what kind of CPU it is? (were to put the compound)
do i need to leave it to settle?
do i do a pea size blob?
do i do a rice size blob?
do i spread it?
do i do a line?
do i do a cross?
or do i not spread it??
AAHHHH!!!

ive read up about it and everyone seams to have a diffrent idea how to do it :/

IC Diamond say to apply "approximately 5.0-5.5 mm bead on center"

should i just go with this??

pc_monkey · 2 Dec 2011 at 02:32

have you read this one?

there is also a video somewhere I'll post if I can find it.

Video is this one.

SpecOps · 2 Dec 2011 at 06:48

if you look about 8 minutes into the vid it shows you how to apply the IC Diamond

hildark7 · 2 Dec 2011 at 11:18

SpecOps said:
if you look about 8 minutes into the vid it shows you how to apply the IC Diamond

i started watching that one the other day but the guy was annoying me so i stopped it LOL!

Skyforger · 3 Dec 2011 at 05:35

Does different type of thermopastes really differ actual cpu degrees ?

DavidS14 · 3 Dec 2011 at 06:43

The difference between thermal compound can make quite a difference on CPU temperatures especially when overclocking. Have a look at skinneelabs compound comparison

bainbridge · 3 Dec 2011 at 11:32

Pea sized blob in the middle is what they say, this gave me 1c cooler temps than AS5.

Tinting both surfaces (very difficult with ICD) reduced temps by another half degree.

Plec · 3 Dec 2011 at 12:36

hildark7 said:
my new kit comes tomorrow and im trying to find out the best way to apply my IC Diamond thermal compound?

What's your cooler?

If you have exposed heatpipes at the base of the HS then the method suggestsed here is advisible as the gaps bewteen the pipes will suck up most of a pea sized blob - resulting in an uneven spread. (Note: DO NOT USE THIS METHOD WITH A SMOOTHED BASED HEATINK - you'll get too much gunk on the CPU.)

However, if the base of the HS is smooth then a rice/pea sized blob in the the centre of the CPU is fine. When you place the HS ontop of the CPU rotate (slightly) from side to side before tightening (i do this so that it sucks the HS to the CPU so it doesn;t move when i start to screw in fixings).

Or, if you wanted to you could spread a small amount over the surface - but with extremely viscous gunk (CF3) this can be very difficult unless warmed first.

As for temp differences between gunks i wouldn't concern yourself too much - as long as it's quality TIM there's is very little difference.

CaptainCrash · 3 Dec 2011 at 12:51

Plec said:
However, if the base of the HS is smooth then a rice/pea sized blob in the the centre of the CPU is fine. When you place the HS ontop of the CPU rotate (slightly) from side to side before tightening (i do this so that it sucks the HS to the CPU so it doesn;t move when i start to screw in fixings).

That's what I do... I really can't be doing with all these contradicting suggestions, or drawing a pentagram in thermal paste while muttering some mystical incantation. Regardless of the CPU or TIM used, I just put a grain-of-rice size blob in the centre, squash it down and twist a bit with the heatsink, and the job's a good 'un.

I do however spend quite a bit of time beforehand making sure the surfaces are absolutely clean and devoid of any contamination.