Thermal Paste: Best application method?

Zefan said:
Yes yes yes this more of this kind of thing please. It never used to matter so much, as the dies were close to center, however this isn't the case in this modern chiplet world. Do yourselves a favour and cross it up my brothers.
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Problem is the variations - most Intel CPUs still use a centred monolithic long rectangle package but then you get some like certain Skylake models which are large squares and Ryzens are like 5-7 different variations of chiplet in some cases with the main heat source more towards one corner if several of the chiplets are dummies or offset from centre due to other smaller packages, etc. etc.

Alder Lake for instance there is almost no point putting dots in the corner or an X, etc. while on Ryzen that can make a significant difference.
 
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I spread the paste out using as little as possible. I judge how much TIM to apply by placing a razor blade over the chip and base of the cooler.
 
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