Thermal Paste Technique Poll?

DHR

DHR

DHR

Soldato
Joined
30 Apr 2003
Posts
3,573
Interested to see what people use in general, I've always used the pea method and never had any problems. There seems to be a raft of different methods now with people rating the X method..... Does it really matter? Which do you use?
 
I used the X method on my 5820k.

I don't think it really matters unless you mess up completely though. Site that I'm not sure I can link to (sells systems) has temp benchmarks on a lot of difference methods, and just a couple of C between them.
 
^ IC diamond D:, last time I tried that it was like clay. Even after sat in boiling water.

I just use pea method, fact is it doesn't really matter as long as you apply enough as it will spread it out evenly anyway. Too little is a problem though.
 
Thread title misleading as no poll :)


Small Blob and then spread with Credit card, but still using AS5, which pretty much has to be spread.
 
Pea method. I remember watching a video a little while back where a guy tried out various methods with a piece of transparent perspex so you could see what happened.

A lot of the methods I've seen talked about, i.e. the credit card approach, didn't seem to work so well.
 
I think the issue is with the spread method inasmuch as it increases the likelihood of getting pockets of trapped air between the CPU and heatsink this seems to be even more likely when you spread the paste over both surfaces. Any method that involves allowing the pressure between surfaces to spread the paste outwards such as pea/rice/cross more or less eliminates this risk.
 
Spread it in a square, fully covering the surface.
Works very well for me, using either Thermal Grizzly & applicator or MX2 & my index finger (wearing a glove, of course).
 
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