TIM: Spreading it is NOT better...

Well, I could've told you that quite some time ago based on the AS5 instructions.
 
what would you do on a 8800gt?

that actually gave me a huge fright, as I fitted my S1 to my 8800gt the other day and just thought "what on earth DID I do on an 8800gt!?" Then I realised I just left AC's stuff on it - Think I probably would've noticed if I had it bare from the temps though.
 
Well, I could've told you that quite some time ago based on the AS5 instructions.
I also followed said instructions, but always felt that maybe spreading would yield a better result :(

When I used AS5 on my GFX, I applied a very small amount. About the size of half a (uncooked) rice-grain ;)
 
It makes sense when you think about the concave nature of the Intel IHS. But for those who lap thier IHS/HSF/WB spreading the paste is more than likely better. Isn't it?
 
Quad is horizontal and dual core vertical right ? I found on my 6420 that the line method gave higher temps the best method for me was a thin layer all over and a small blob dead center.Line method was about 6 degree's hotter.
 
Looking at the amount he spread on his IHS its not surprising the 'dollop' method wins out. I don't use half as much as he did in that photo! What was he thinking? Its not a slice of bread he's buttering :rolleyes:.
 
why does the thermal pad do better in the second test than the first ?

surely they cant apply it differently ? test seems bleurghh
 
I've tried both spreading and the line method on my lapped CPU and it didn't make any difference as far as i can tell. Seeing if more was better in the past trying to fill the gaps and compensate for an uneven heat spreader has shown very bad results, as much as 7C rise.
 
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