Stock Card :
My idea :
Basically the orange represents a cut copper sheet about 2mm in diameter, folded up 90 degrees at the end of the card. It will be lined with little heatsinks/ramsinks attached to it via thermal tape(represented by dark orange).
The copper sheet will be attached to the VRM area via thermal tape and two securing screws at each side of the PCB.
So, does this seem like a viable idea to cool the VRMS of the card? My logic is I will be able to fit about 2/3x the amount of ramsinks that I would normally be able to fit on the area, and I have a fair few spare ones lying around.
Any opinions?

My idea :

Basically the orange represents a cut copper sheet about 2mm in diameter, folded up 90 degrees at the end of the card. It will be lined with little heatsinks/ramsinks attached to it via thermal tape(represented by dark orange).
The copper sheet will be attached to the VRM area via thermal tape and two securing screws at each side of the PCB.
So, does this seem like a viable idea to cool the VRMS of the card? My logic is I will be able to fit about 2/3x the amount of ramsinks that I would normally be able to fit on the area, and I have a fair few spare ones lying around.
Any opinions?