What is the correct way of applying MX-3?

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What is the correct way of applying MX-3?

I’ve read all the threads and viewed all the available videos. It seems that there isn’t a correct way of applying MX-3. It looks like everyone has their own method of application.

What’s confusing me even is the ‘line’ method. Some here say a vertical line of TIM for quad core CPU (with the triangle mark in the bottom left hand corner) and some say a horizontal line.

Some say a rice-grain size blob in the middle and other say to spread the TIM over the entire surface of the heatspreader.

So, which is best?

My CPU is an i7 950 fitted with a Titan Fenrir heat sink and fan.

Thanks.
 
Blob all the way, there's a vid on youtube somewhere showing how the other methods cause air bubbles or don't spread evenly.
 
I’ve viewed all the available videos. The ‘blob’ method seems to be most popular. I just hope I don’t over-do-it. I understand that too much TIM can be detrimental.

Thanks for all the replies.

Kimmy
 
One last question.

Which way should I orientate the heat sink and fan? My case is an Antec 900 with a large fan in the roof. Should I turn the heat sink and fan 90 degrees, so that it faces the roof fan or should I face it to the back of the case?

I’m not sure if it makes any difference. Which way around have you guys got it?
 
I use a blob, garden pea size.

I don't think using too much makes bad times, it just pushes out the sides, and MX3 is non conductive so if it drips on the board or something, doesn't matter. :)
 
One last question.

Which way should I orientate the heat sink and fan? My case is an Antec 900 with a large fan in the roof. Should I turn the heat sink and fan 90 degrees, so that it faces the roof fan or should I face it to the back of the case?

I’m not sure if it makes any difference. Which way around have you guys got it?

Warm air rises so making it face upwards would prob be the best option. Although the change will most likely be minimal.
 
I have always used the "rice grain" method and allowed the pressure from the heatsink to spread the paste over the cpu. You can spread it with a credit card but it can get messy far simpler to drop a dot ;p
 
rice grain is the best method. i was worried about my temps, and the mod said that my temps are better than his.

so it is safe to say a rice grain works the best.

the reason behind it is that there is enough tim to get into the nocks and cranies of the cooler and keep the air out between the cpu and cooler.

the centre outwards is the hot spots. the edge of the cpu isn`t going to be hotter than the middle. hence why a grain of rice sized of tim can get roughly a 10p sized spread when a cooler is placed on top and tightened to the cpu.
 
One last question.

Which way should I orientate the heat sink and fan? My case is an Antec 900 with a large fan in the roof. Should I turn the heat sink and fan 90 degrees, so that it faces the roof fan or should I face it to the back of the case?

I’m not sure if it makes any difference. Which way around have you guys got it?

On both my Antec 900 and 1200 I have the cpu cooler fans pointing towards the back of the case.

Reasoning is , you have a front fan pulling air in, the cpu fan then pulling it across the heatsink and the rear fan expelling it - cleaner air flow. And i have good temps with both machines.

The top fan will expell the heat that rises of the heatsink anyway, without needing it to be forced up.
 
On both my Antec 900 and 1200 I have the cpu cooler fans pointing towards the back of the case.

Reasoning is , you have a front fan pulling air in, the cpu fan then pulling it across the heatsink and the rear fan expelling it - cleaner air flow. And i have good temps with both machines.

The top fan will expell the heat that rises of the heatsink anyway, without needing it to be forced up.

Yep when I had my 900 I did the same.
 
I had to turn the heatsink and fan to expel air via the top 200mm fan. The Titan heatsink with attached fan is so big it blocked the first RAM slot.

Seems to be working OK.
 
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