Why watercool

[Cycrow]

I disagree having my 1x 140mm on an archon running a Q6600 at 3.6 ghz at even 1240 rpm nevermind undervolted is very quiet.
And yes I can compare it to a very low rpm and noise level 120mm fan.
You guys are talking about people with 2x noisy high rpm 120mm fans on a heatsink and case fans.
I have compared 2x120mm fans at 5v and there's virtually no difference in noise level compared to a single 140mm at around 1000rpm.
Oh and my gpu is always very quiet too as I normally have a low rpm fan and aftermarket cooler on mine.

I never said air cooling is better I was more saying the noise levels aren't such a massive difference these days with the right fans and heatsinks.
btw those akasa fans are actually considered noisy (especially noisy on an h50) so no wonder it's a huge difference to your ears.

I don't think the big noise gap is there any more and I am pretty sure you'll need a bit more than a couple of fans at 500rpm to cool a whole rig at a high overclock.

im sure u have more than 1 fan cooling the CPU thou
most likly u'll have 3, 1 on the heat sink, one intake into the case, and 1 exhust

the fan on the heatsink alone wont be able to keep your system cool

with watercooling, ur not replacing a single fan with the rad, ur replacing all fans

 

[OLDPHART]

Sorry, what? You think that the gap between transistors does anything to AID cooling? If anything it makes it worse.
lol.

1- If you think about it as the chip gets smaller theres less space between the eletronic components,

2- so theres less air circulating around them to cool them,

3-so the heat builds up.

If you think about it as the chip gets smaller theres less space between the eletronic components, so theres less air circulating around them to cool them, so the heat builds up.

Is that easier for you to under stand > paradigm

 

[paradigm]

I think you misunderstand thermodynamics of silicon based processors.

An "air" (lol, air gap on something 28 microns) gap will cause a HOTTER processor, due to there being more insulation between the "components" and the heatsink/cooler.

A smaller process means a cooler processor on the whole, IF the processor was like for like (k-transistor count, instruction sets, clock speed), as the lower sized gates require less power to switch.

The point is, we migrate to lower processes in order to put MORE on a single die, therefore heat output (and thermal envelope) stays the same.

 

[OLDPHART]

I think you misunderstand thermodynamics of silicon based processors.

An "air" (lol, air gap on something 28 microns) gap will cause a HOTTER processor, due to there being more insulation between the "components" and the heatsink/cooler.

A smaller process means a cooler processor on the whole, IF the processor was like for like (k-transistor count, instruction sets, clock speed), as the lower sized gates require less power to switch.

The point is, we migrate to lower processes in order to put MORE on a single die, therefore heat output (and thermal envelope) stays the same.

lol cheers for that quick lesson paradigm, l was born when tellys weighed a ton due to the size of the tube, etc and you just gave it a swift clout to get it working again, dare l mention it good old black and white.