• Competitor rules

    Please remember that any mention of competitors, hinting at competitors or offering to provide details of competitors will result in an account suspension. The full rules can be found under the 'Terms and Rules' link in the bottom right corner of your screen. Just don't mention competitors in any way, shape or form and you'll be OK.

4770 Hot Hot Hot

heres an interesting page from bit-tech review

http://www.bit-tech.net/hardware/2013/06/01/intel-core-i7-4770k-cpu-review/7

note 4770k @ 4.7 vs the 2600k @ 5

in Cinebench the 4770k was still 4.5% quicker even though at lower clock

the telling part is the last graph on that page - power consumption at load at those overclocks ... 110w less for the 4770k - thats a HUGE amount, thats both a big chunk less electricity- and 110w less heat being pumped into your case :)

That does assume you can get one to 4.7GHz in the first place though...

It's a sad situation, but it's essentially a zero-risk cost saving measure on Intel's behalf, they'd be mad not to do it. They're so far ahead that anybody that cares about performance (outside of very specific computing tasks) will always buy Intel.

It's a scumbag move for sure, but there's not really any other option for enthusiasts. I'd love nothing more than for AMD to drop a killer OC chip (Athlon XP 2500+ days? xD). It wouldn't even have to match Haswell in IPC, just close enough that the overclocking potential makes it nice and juicy.
 
anyway - we still don't even know if its technically possible to solder on these anyway - there maybe a process/manufacturing reason why they are - as they are

we are all assuming its due to cost

It would explain why IB was TIM wheras IB-E will be soldered.

----------------------

Does anyone else remember "back in the day" TIM was a white paste that came in tubes, one of the major factors in the popularity rise of 3rd party TIM like AS5 was Intel releasing a CPU (P4 line IIRC) that could not be cooled using conventional TIM and its stock heatsink lol. Not that relevant but a nice blip down memory lane :P
 
Its not just haswell.. The latest batches of Ivybridge are soo inconsistent with temps its unreal. You can have a spread of temps across cores that can be up to 15 degrees difference. With a good air cooler at 4.3 some will struggle to stay under 90 degrees in IBT and others are fine at around 80 degrees with the exact same setup (Bios settings, components, voltages etc) Its not good but I would suggest that intel are not really bothered as they know that the product is tested at the stock speeds with a stock cooler and it maintains stability and correct temps. That's all they really need and its an added bonus for them that people are delidding and voiding the warranty as there will be no comeback on them.
 
It would explain why IB was TIM wheras IB-E will be soldered.

----------------------

Does anyone else remember "back in the day" TIM was a white paste that came in tubes, one of the major factors in the popularity rise of 3rd party TIM like AS5 was Intel releasing a CPU (P4 line IIRC) that could not be cooled using conventional TIM and its stock heatsink lol. Not that relevant but a nice blip down memory lane :P

Where has Ivy-E been confirmed that it will be soldered ?
 
K CPU's should be soldered, doesn't matter about the non K versions, as no one would clock them anyway, would rather pay a premium for it, than to have CPU's that turn into erupting volcanoes past 4.5 / 4.6 GHz.
 
Is going the Sandy/Ivy-E path worth it for just gaming though? Or should people chuck more money at a better cooler and go with Haswell route?

Surely a Haswell build will, overall, cost less than a Sandy-E build?

Where is Ivy-E anyway? I've been to busy over at the AMD camp and have fallen behind.
 
I can't remember if 8Pack confirmed it, or heavily implied it to the point of the being no doubt, but either way I take that as gospel.

Isn't the official word from Intel that the 22nm chips use TIM because of problems that arise with the Tri-Gate transistors when using solder?

If so then we can probably assume that the Ivy-E chips will use TIM.
 
Isn't the official word from Intel that the 22nm chips use TIM because of problems that arise with the Tri-Gate transistors when using solder?

Yes, working around those issues would be expensive, hence why its not being done for the mainstream chips only the enthusiast ones.
 
Isn't the official word from Intel that the 22nm chips use TIM because of problems that arise with the Tri-Gate transistors when using solder?

We'll see if that's true when IB-E comes out but if you look at SB-E CPU's (even the 3820) they all have a hole in the heat spreader which allows air to escape when installing it to get a better contact. Given that P4's used to have it and non of the SB/IB/HW do I think it's safe to say that Intel don't take as much care or just want to artificially handicap them.
 
From what I've read so far they start throttling around 90°. I wouldn't want one running anywhere near that though. Max mid 70's for me, preferably lower.
 
Back
Top Bottom