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5820K Thermal paste application...

Daytrader said:
Well i used credit card method on my 7 year build, and temps still the same to this day, think i will be useing that on my skylake 6700K ;) remember, we have all been useing it for like 20 years before with no problem :)
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i use a bent over credit card method.always worked fine.
 
Just remember you only need enough to fill the tiny imperfections in the surfaces and to connect the 2 surfaces. Any more than that is just going to impede thermal transfer. Small grain of rice method usually suffices for Cpu's. Gpu's I tend to spread making sure the whole die is covered.

This is all moot for me as I use liquid ultra most of the time.
 
Nice, I've used it on different gpu's and cpu's. Not on my current system yet though. I didn't have any and I found some AS5 knocking around. When my new shrouds come for my hybrids i'll liquid it all i think
 
The new chips are smaller than the old, i doubt i put on a 3rd of a pea size, pea size is massive really, unless you mean the Petite Peas ;)
 
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