I forget the name of the company that uses electron microscopes to check out process nodes/new chips and generally do reports and give the basics on real feature size seen. After that story that site will make for an interesting read at some point in 2020. It also doesn't sound surprising, to go from 'hey we're launching' to, small dual core can't even work with the gpu enabled to 18 month (minimum now) delays certainly implies that yields were genuinely dreadful.
He states 60% is where most fabs want to be for early volume production yields that you then want to ramp up, you can do risk production at significantly lower yield particularly in two scenarios, it gives you a market leading advantage and/or you sell server chips with silly margins. To me it's certainly obviously Intel has to be way below 30-40% range that you could be selling small Xeons for and still be profitable if they gave huge power advantage. Hell Intel pushes loss leading stuff all the time with contra revenue in mobile and elsewhere, they could simply push chips at a loss simply to not face terrible news in the stock market with continued failure with 10nm so if it could be out at all... it would be imo. IT certainly implies the node is just simply not capable of producing fully working chips. Remember even with the stated 8-10% yield, that's for half working dies with the gpu disabled, that's shocking.
THe smallest feature that really matters on their node is the 36nm metal pitch and that is using cobalt which is the big new step for the node... so that will almost certainly be the part that probably gets cut. Back to copper, match TSMC/Global with 40mm metal pitch, I believe their fin pitch was already larger which probably puts them at a ~12nm node.
I mean, I've heard of year long delays for nodes, but we're talking 4 years from 2015 to when they state it will now come end of next year. This is the industry leader on nodes for a few decades.... 4 years is a truly major monumental screw up such that if it could have been fixed it's likely it would have been literally a couple of years ago already. There were already major signs of problems with their 14nm with big delays that for Intel were unheard of and 10nm just looks to have doubled down on their issues.
Other fabs have delays but it's usually more about timing or fabs not being ready. Glofo delayed/cancelled 32nm but that was more because the fab was simply finishing in a midpoint between 32nm and 28nm so it made little sense to be on 32nm. Then when the fab was finally finished it was their first fab bring up, it was the first new fab for anyone at AMD for well, a long long time so that isn't surprising. A 4 year delay is... we're talking 1-2 full process node steps that can happen in that period of time.
Coupled with that Charlie is also saying Icelake has a major performance flaw that won't be fixed because it's fundamental to the design.
EDIT:-
https://www.extremetech.com/computi...ed-reveals-impressive-finfets-13-layer-design
not that site but it links to a story and shows some pictures. Chipworks is the site that does scans of chips and shows off feature sizes in real world chips. Their first pics of 10nm chips will interesting to see for sure.