IC Diamond24/Perihelion4gm Giveaway

We did some thermal stress testing on IC diamond (ICD) against the more popular retail compounds all failed except ICD in this test.

20hoursat150C.JPG

Sounds like this stuff is ideal for my system, the one on the right looks like AS5.
 
I wanted to ask aswell that when you take heatsink off the cpu, why thermal compound has partly turned hard and crispy like a 'dried earth'? Is it due to heat?

driedearth.png
 
ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS

I would love to try some against the MX-3 I am currently using on my Q6600 @3.2Ghz :)
 
Yes samples are out - shipping from USA so be patient.

There is a change in the program as we have had no requests for a few days we are CLOSING DOWN THE GIVEAWAY PORTION OF THE PROGRAM This is a time crunch issue on our end as we have other giveaways scheduled and have to move on. In any event we have enough participants to run a successful survey here.

Those that have requested samples will receive One ICD24 and one Perihelion 4gm in place of one ICD24.

It is optional to the tester which sample he tests but one or the other must be posted, optionally they can test both and report both if they feel inclined.
 
Awesome! I am doing my first watercooling as well! So I will try both and some MX-3. My AS5 I have here might be a tad out of date :)
 
Yes samples are out - shipping from USA so be patient.

There is a change in the program as we have had no requests for a few days we are CLOSING DOWN THE GIVEAWAY PORTION OF THE PROGRAM This is a time crunch issue on our end as we have other giveaways scheduled and have to move on. In any event we have enough participants to run a successful survey here.

Those that have requested samples will receive One ICD24 and one Perihelion 4gm in place of one ICD24.

It is optional to the tester which sample he tests but one or the other must be posted, optionally they can test both and report both if they feel inclined.

look forward to recieving and testing

many thanks!
 
Yes samples are out - shipping from USA so be patient.

There is a change in the program as we have had no requests for a few days we are CLOSING DOWN THE GIVEAWAY PORTION OF THE PROGRAM This is a time crunch issue on our end as we have other giveaways scheduled and have to move on. In any event we have enough participants to run a successful survey here.

Those that have requested samples will receive One ICD24 and one Perihelion 4gm in place of one ICD24.

It is optional to the tester which sample he tests but one or the other must be posted, optionally they can test both and report both if they feel inclined.

I am looking forward to testing these TIMs for you, should be very interesting!
 
ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS

I'm In! Will be testing on AMD B55 @3.8 and maxed out HD5830 with Zalman VF3000A cooler
:)
 
:( NOOOOOOOooooo way!
What a bummer, i didn't realise. O well looks like i'll have to purchase some to reduce my temps
 
FAO IC Diamond:

I have Thermalright IFX-14 cpu cooler as stated before. I use the pea sized blob method as stated in the IC website. Last time I took off the cooler as I wanted to check what was the MX-4 pattern. It seems like the tim in the centre has dried up and seems to correspond with the findings by the xbitlabs where they suggested convex base of the cpu cooler.

They suggested in another article concerning cogage arrow (IFX-14 upgrade) that thermalright products come with this feature as it is meant to provide greater contact in the centre. So may be this is why I get this pattern which xbitlabs also get.
http://www.xbitlabs.com/articles/coolers/display/thermalright-cogage-zalman_2.html

q6600tim1.png



q6600tim2.png



q6600tim3.png


http://www.xbitlabs.com/articles/coolers/display/thermalright-ifx14_6.html
q6600tim4.png



q6600tim5.png


Here is the mounting system.
ifx14mountingsystem.png



So if I were to apply IC Diamond, I am sure I will get the same pattern. Do you think this will affect results? I don't want to lap the cooler base if the manufacturer purposely designs the heatsink base like that for greater surface/pressure contact in the centre:).

many thanks:)
 
ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS

I got a Q6600 @3.6 here that I can test it against artic mx-3

also just about to get a 2600k so can test the difference on that too.
 
"ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS"


go on then i'll give it a try :)
 
Paste is very heavy off center

I spent some time with the TR people a couple of years ago and I think they are some of the best in the biz. I do not have that heat sink in house so have had not a close look at it.

So hard for me to second guess their designs and and how they line up with our paste.

The contact area is narrow but pressure will be high in area of contact so a 50 lb mount might yield 100 psi + in the contact area a big plus as far as any thermal compound goes.

But there will also a trade off with the diminished contact area, as to how much I can not say.

The two pole/point mount do sometimes come with a bias on one side or the other as I have seen in some water blocks.

I do some heat sink/thermosyphon design and generally find copper base should be .160 - .180 thick to adequately spread the heat, like I said from the pictures hard to tell but from the contact I would be worried about the heat spreading to the outside heat pipes.

For instance I can not test a heat pipe cooler on a one centimeter die as the heat will not flow to the outer pipes and will give a poor performance reading. On a 1 inch die they test very well, the design intent obviously is for a larger contact .

My own experience tells me that the more contact the better and I have seen recent contact/ pressure paper snapshots of similar result that when lapped improved the thermal performance.

Like I said the TR guys are good and have a different perspective if I had to speculate I would say the real reason they bowed the mount was to try and compensate for IHS contact irregularities, I think the Intel spec is Flat & // to within .002 but in that range you find IHS's with peak in the middle or a island in the lake with peaks in the middle and edges or some that are shaped like cup with higher edges all the way around and a depressed interior area.

These kind of contours are fine for the Joe six pack kind of computing guy they just gap it with the design intent of thermal compound.

For the more rarefied performance user getting everybody on the same page with these kind of contours as few go through the effort of lapping this may be a TR's stab at it.

So to answer your question - as a guess you will see -2 to -4 C if you get it balanced right and are not hung up on the edges - your pressure is great as the contact area is light but shows the paste as a thin layer having resolved down to the average particle size/thickness - and of course depends on the previous compound applied and applied power.

The contact images below show the variation in IHS/Sink contact for typical endusers

Some hang on the edges, the middle or both, some are balanced to one side or the other.

And some, just a couple have all around both great contact and pressure:D



samttl.jpg
 
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