AMD will have ordered wafers some time ago. I’d imagine it’s AMD parts that’s partially responsible for the delay.
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3900X & 3950X Availability?
- Thread starter Meritor
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AMD will have ordered wafers some time ago. I’d imagine it’s AMD parts that’s partially responsible for the delay.
Probably wouldn't solve any fabrication delay issues going to Samsung as it would take awhile to get their design up and running there. Might be part of why nVidia spent quite awhile evaluating availability and cost effectiveness at 7nm before moving some production to Samsung awhile back.
Also don't forget we are getting close to the point that orders for both the next xbox and playstation will have to enter manufacturing, that plus all the Ryzen/Threadripper dies that people are screaming for. It could be rubbish but it wouldn't surprise me if that's whats happened, unless AMD use Samsung for consoles - doubtful.
damn you’re right. Not long till TSMC needs to start making millions of custom 7nm apus for the ps5 and Xbox 2. I guess 7nm global supply is going to tight for the next year.
which is why Nvidia looked at it and said that’s not going to work for us so they went to Samsung
The processors for xbox and PlayStation shouldn't affect supply of zen 2 much, the orders for the wafers for them will have been placed quite a while ago.
The popularity of Epyc will be hitting supplies for the top Ryzen processors and Threadripper though as AMD will want to use the best chiplets in the most profitable chips.
The popularity of Epyc will be hitting supplies for the top Ryzen processors and Threadripper though as AMD will want to use the best chiplets in the most profitable chips.
The upcoming consoles are on the new 7nm EUV node and so are all the new CPUs & GPUs after April next year. Also AMD is in talks with Samsung to split 7nm EUV production in February between Samsung & TSMC.
The stock issue is AMD didn't calculate correctly that the EPYC server orders will be so high and come in so fast and the server orders take priority over consumer products.
Also AMD neither expected consumers will opt en masse for 3900X instead of the 3700X/3800X.
If Xbox and PlayStation use the chiplets then I can see them getting the comparatively junk silicon out of the bins since they're going to be downclocked anyway. 8 core PS5 could easily be 2 quad cores dialled back to stay around 3GHz and then strap in the Navi 20 chiplet. There's no "new" wafers required then.
I doubt that Sony and Microsoft would agree the chiplets. They want their own custom APU design. Why not with HBM2/3, though?
AMD should have stopped the production of Ryzen 5 3600/X and relocate the dies for the 12-core SKU, and start offering other 12-core SKUs too.
The 6-core Ryzen 5 3600 is not needed - they could offer the Ryzen 7 2700 from the GLOBALFOUNDRIES instead!
Why would Sony and Microsoft decline the chance to increase their profit margins by insisting on a custom APU, rather than chiplets? Right here and right now, Zen 2 is not a monolithic die, so why would Sony and Microsoft waste money by funding the creation of an APU? Unless both consoles will be, in fact, powered by Renoir.
Don't bother to explain technical stuff. The new consoles aren't monolithic APUs almost everyone knows that.
Caporegime
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Given the 3900X availability, it's not surprising.
Sony and Microsoft would be more in the red if they try to use 3 chiplets instead of a single monolithic die. And the usage of chiplets increases the complexity of the whole solution.
No, it really doesn't.
No it doesn't. Next consoles are coming with chiplet, using exactly the same Zen2 8core chiplet albeit with different I/O and a GPU chiplet.
** removed ** Prove that using 3 wafers for 3 different chips plus the requirements for assembly make the solution less complex than using 1 wafer for a single die 
The wafers can come from different parts of the world, too.
The wafers can come from different parts of the world, too.
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You are a just a forum troll. Prove that using 3 wafers for 3 different chips plus the requirements for assembly make the solution less complex than using 1 wafer for a single die
The wafers can come from different parts of the world, too.
Sony and Microsoft have both said they are using zen 2 8 core cpu and a 5700 class gpu.
Amd have proven how good the chiplet style works for them with the 3900X etc why make it one big die? And why not just translate what they have achieved on desktop and add it to a console much cheaper then making a speciel die for consoles ?
as for costs making one big die is allways more expensive and more complex die = less yield rate for said die.
the PS5 and Xbox 2 will use a chiplet style cpu+ gpu maybe on one overall chip but still using 12nm io chiplet and maybe 1 or 2 7nm zen 2 cpu chiplet’s with single 8 core or 2x 4 core and 7nm 5700 gpu
why would amd change there there system now for consoles that need to hit a certain price point not like consoles can afford to put a pure 3700x and 5700 gpu pc parts and still sell at a lower price then pc’s
The entirety of Zen 2 is built using chiplets, yields are rumoured to be in excess of 80% and the entire thing costs less than the equivalent Intel monolith, especially on servers.Prove that using 3 wafers for 3 different chips plus the requirements for assembly make the solution less complex than using 1 wafer for a single die
3 wafers for 3 different chips? ** Comment removed - Personal attacks will not be tolerated. **
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Yes, 1 wafer from GLOBALFOUNDRIES' 12nm process for the cIOD.
1 wafer from TSMC 7nm for CPU
1 wafer from TSMC/Samsung/GLOBALFOUNDRIES for GPU.
Which equals not 1 BOM but 3 BOM, and dependence on the processes of different factories.
Also, Ryzen 9 3900X is a fail. It is extremely overpriced and consistently out of stock.
Ryzen 9 3950X is even worse - pushed back from September to November.
The chiplets for the consumer are not cheaper.