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7700K Delid-30c cooler!

8 Pack said:
Temps no issue with correct cooling etc.
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Ever since Ivy Bridge Intel K series CPU's have had the same issue were they wil overclock and temperatures will increase proportionality to the clock speeds to a point. When you start going above 4.6 (based on IB) the temperatures spike and it doesn't matter what cooler you use all Intel mainstream chips follow the same behaviour.

On Ivy Bridge this was blamed on the theremal paste, on Haswell and Devils Canyon users reported issues with the theremal paste and the ihs lid being concaved. It would be nice if Intel offered bare die CPU's with a limited warranty for thos us who are serious about overclocking.
 
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Me thinks the only reason Intel use **** TIM is its cheaper and easier to manufacture.

Like any other billion dollar corporation they're looking for ways to keep shareholders happy, to the point the customer gets slightly shafted.

The Skylake price hike also suggests this.

To summarise:

Intel, like all other billion dollar corporations are ****'s
 
Bluntwrapped said:
Me thinks the only reason Intel use **** TIM is its cheaper and easier to manufacture.

Like any other billion dollar corporation they're looking for ways to keep shareholders happy, to the point the customer gets slightly shafted.

The Skylake price hike also suggests this.

To summarise:

Intel, like all other billion dollar corporations are ****'s
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I've read a few technical reasons why Intel uses TIM instead of solder but I don't know what the official reason is. As soon as they dropped to 22nm they switched to TIM one reason I read was solder wasn't suitable for smaller dies another reason given was solder wasn't suitable due to the constant thermal cycling/temperature variations on latter chips.

Theremal cycling is an issue because Intel is trying to solder copper and silicon together and there materials you can't solder using normal tin based soldering material because it won't stick. You can use Indium but then you need to coat your die and IHS with Nickel and gold in order for it work.

This is all very and good but Indium does shrink under constant thermal cycling and if you have applied wrongly and glued the IHS to the PCB when it shrinks the substrace can pull upwards and potentially crack the die (an issue for Skylake since the substrace is a lot thinner then older generations). Indium is also also expensive just look at the price of it the commodity markets, it properly explains why Intel only uses solder on the top end chips.
 
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Freddie1980 said:
Indium is also also expensive just look at the price of it the commodity markets, it properly explains why Intel only uses solder on the top end chips.
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I wouldn't read too much into the other theories, Intel have been looking at cutting CCG costs to reinvest in other markets for years now. I believe in the last year Intel have taken in the region of $600 million out of operating expenses with aim to more than doubling this to $1.5bn next year. Kaby lake suckers? lol

Skimping on TIM really barely scratches the surface but again I'm sure it's all part of the cost saving exercise.
 
Freddie1980 said:
Ever since Ivy Bridge Intel K series CPU's have had the same issue were they wil overclock and temperatures will increase proportionality to the clock speeds to a point. When you start going above 4.6 (based on IB) the temperatures spike and it doesn't matter what cooler you use all Intel mainstream chips follow the same behaviour.

On Ivy Bridge this was blamed on the theremal paste, on Haswell and Devils Canyon users reported issues with the theremal paste and the ihs lid being concaved. It would be nice if Intel offered bare die CPU's with a limited warranty for thos us who are serious about overclocking.
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We will offer binned CPU's within Bundles with CPU's delidded and TIM replaced with Liquid metal. All with full warranty with OCUK.
 
I bin with set voltage yes but typically 24-7 voltages is either slightly more or less than the binning voltage for a certain frequency.

For stability testing we use a combination of real bench, none avx prime with 3d running and Xtu cpu + memory stability test plus 3d running. 3d is like a bench such as Valley or heaven. This maxes out all the controllers on the Cpu at once.
 
I've tested a small handful and non avx prime is no issue on stock intel TIM up to around 1.3-1.35v with AIO and good paste. 1.35v is about the limit for XTU. Obviously chips will vary in temp but I wouldn't say the stock TIM is bad by any means. I remember I couldn't even go past 1.3v with one of my haswell due to temp throttle!

Kaby is strong. It's a great chip even without delid for gaming. Cpu bound will benefit from higher core clock and even non cpu bound should benefit from raise in minimum fps.
 
7700k will be next few months/years the best gaming cpu. Not the most powerfull in raw performance/mutithreading just the best for gaming for the highest PPC.
 
All those comparison shows are absolute rubbish. 7700k is made for overclocking, clock for clock sure there's not much difference but in the real world where guys oc chips it exceeds skylake for average clock.

They should either compare them stock vs stock or oc both. Then you're gonna have a more realistic comparison.
 
Doug2507 said:
All those comparison shows are absolute rubbish. 7700k is made for overclocking, clock for clock sure there's not much difference but in the real world where guys oc chips it exceeds skylake for average clock.

They should either compare them stock vs stock or oc both. Then you're gonna have a more realistic comparison.
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I just watched another Youtuber 'easily' get to 5ghz with one. But who knows if Intel have sent out cherry-picked CPU's to reviewers.
 
southernorth said:
I just watched another Youtuber 'easily' get to 5ghz with one. But who knows if Intel have sent out cherry-picked CPU's to reviewers.
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I was starting to think that, ive seen a few reviews getting to 5ghz now, i just watched a vid with a guy called bitwit and hes getting 4.9 at 1.13v so god knows how high that chip will go.
 
Nice :cool:

5_6.jpg
 
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