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8 core coffeelake on Z370 ?

https://www.reddit.com/r/intel/comments/8lsn2k/intel_technical_documents_leak_8_core_coffee_lake/

Intel Technical Mehlow Processor VR Test Plan documents revision 1.5 added Coffee Lake-S 8 core 80W and 95W SKUs but after information OP leaked on reddit, Intel removed the description so thankfully OP had saved the screenshot before Intel removed it.

DTLufjk.png


So it will have 2 chips, 95W 8 core CPU will be K version and 80W 8 core CPU will be non K version just like 8700K 95W TDP and 8700 65W TDP.
 
95W? Wonder what all core turbo speeds they can scrape with that...

Edited to say... i bet thats at base clocks... boost will be...
a
wee
bit
higher
:p:p:p
 
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Dicehunter said:
If AMD keep doing well with Ryzen, Ryzen 2 etc... mobo makers will eventually start making motherboards that don't look cheap and nasty.
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They also seem to ignore the mATX form factor. Otherwise I would be tempted to switch. Looks like Intel will get my money again for a bugged CPU and minor socket iteration. :(
 
Dicehunter said:
Just curious if anyone has seen any "leaked" info, I know the upcoming Z390 chipset is basically just Z370 with a few tweaks, Curious to see if Z370 boards will be able to run the 8 core coffeelake part or if Intel do their usual unnecessary anti consumer practise of a new chipset every 9-12 months.
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9700k 8 core Coffeelake (Coffeelake, Kabylake and Skylake are all the exact same architecture) will only work on Z390 motherboards, as it will require additional power delivery, plus it's a way for Intel to get more money.
 
4K8KW10 said:
The thing I find disturbing is that the Intel motherboards somehow look better than the AM4 motherboards.
More features rich and cheaper :eek:
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What examples do you have that manufacturers are slacking on AMD boards.

I know some manufacturers have being going nuts with the power sections for AM4 X470 to the point where it's hugely overspec for the chips that exist, encouraging rumour that it's done for future chips which will need it.
 
Hotwired said:
What examples do you have that manufacturers are slacking on AMD boards.

I know some manufacturers have being going nuts with the power sections for AM4 X470 to the point where it's hugely overspec for the chips that exist, encouraging rumour that it's done for future chips which will need it.
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There are no Asus ROG Maximus Code and Formula with X470. The design of the Formula is something never seen on any AM4 X470 board.
Z370 Gigabyte Aorus Gaming 7 has 3 M.2 slots. The X470 equivalent has only two.
The Z370 GAMING PRO CARBON INTEL Z370 (SOCKET 1151) DDR4 ATX MOTHERBOARD has the first M.2 slot next to the CPU where it will get better cooling, in general.
Asus Strix models more with Z370.

Well, maybe if there is solid competition from Intel, and AMD decides to release 130W+ 7nm CPUs for X470 but highly, extremely unlikely.
 
No way the base clock will be 3.7 GHz unless they up the TDP. I don't think they've gone above 100 W TDP for a mainstream part in many years.
 
southernorth said:
I'm interested to see if Intel starts soldering their processors again. Hope so.
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Never gonna happen. Ever since Intel gave away tons of free performance and killed their own upgrade cycle with Sandy Bridge - espeically the i7 Ks - they've gimped every generation since with the toothpaste TIM. You pay a premium for overclocking potential, but that potential is removed with poor thermals. So if you want to get faster CPUs then either risk trashing it with a delid or buy the next generation.

People say it's a cost-saving measure to not solder, I say it's to cripple free performance and force upgrades.
 
DragonQ said:
No way the base clock will be 3.7 GHz unless they up the TDP. I don't think they've gone above 100 W TDP for a mainstream part in many years.
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Indeed, to get those low TDPs they must be running the base clock close to 3big ones, either that or some magic.
Of course they dont... ahem... show the power required at full boost !!!! lol
 
https://www.reddit.com/r/intel/comments/8sjfla/cfl_8c16t_r15_2215/

S0GvNrF.jpg


8 core Coffee Lake-S ES at low 3.10GHz clock scored 2212 marks in Cinebench R15 benchmark, faster than 10 core i9 7900X at 3.32GHz clock scored 2184 marks and also completely destroyed 8 core Ryzen 7 2700X at stock clock scored around 1828 marks, 4.4GHz OC scored 1964 marks on Guru3D review and as fast as Jumper118's Ryzen 7 2700X OC to 4.9GHz at insanely 1.679V probably on LN2 scored 2261 marks on OcUK Cinebench R15 benchmark thread.
 
LePhuronn said:
Never gonna happen. Ever since Intel gave away tons of free performance and killed their own upgrade cycle with Sandy Bridge - espeically the i7 Ks - they've gimped every generation since with the toothpaste TIM. You pay a premium for overclocking potential, but that potential is removed with poor thermals. So if you want to get faster CPUs then either risk trashing it with a delid or buy the next generation.

People say it's a cost-saving measure to not solder, I say it's to cripple free performance and force upgrades.
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Err? :confused: Why not just leaving the chips exposed directly to the corresponding coolers, shipping without IHS, just like mobile processors are being shipped?!
This is super stupid by Intel - chip - chewing gum - IHS - another layer of chewing gum - and finally the bottom of the cooler :kookoo:
 
4K8KW10 said:
Err? :confused: Why not just leaving the chips exposed directly to the corresponding coolers, shipping without IHS, just like mobile processors are being shipped?!
This is super stupid by Intel - chip - chewing gum - IHS - another layer of chewing gum - and finally the bottom of the cooler :kookoo:
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Many years ago AMD chips shipped with an exposed CPU die but it made them very susceptible to damage. Given the size of today's coolers and the mounting pressure required for AIOs I'd imagine the risk would be greater.
 
zola25 said:
Many years ago AMD chips shipped with an exposed CPU die but it made them very susceptible to damage. Given the size of today's coolers and the mounting pressure required for AIOs I'd imagine the risk would be greater.
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Of course with the needed redesign of the sockets, so possible pressures during mounting are redistributed upon something else, not the naked chip itself.
Every problem has a solution and this is quite an easy one.

See, I don't know what the solution is to silly 'political' games... The chewing gum is just a political decision to screw users up. It doesn't force users to upgrade more often.
What stopped users to upgrade after Sandy was the lack of innovation and progress.
 
There has to be better solution than the current one certainly, and I think you're correct that socket designs would need to change.

Like many others I don't buy Intel's solder micro cracks answer.
 
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