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Do We care ?? ... I don't not as long as it works !!!!
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What?
Do We care ?? ... I don't not as long as it works !!!!
In case people have become confused by all the cross talk of TDP and power draw in this thread, were not talking about a CPU that's rated at 125w TDP and consumes >125w power, that's a given, we're talking about a CPU that is officially rated and marketed as being 125w TDP yet is actually ≥140w TDP and consumes nearly 200w under full load.
I guess you are talking about my power draw conclusions
Ahh no sorry, should have clarified that, the post referenced in the OP is just one of many and another one shows a report done by techreport on the peak draw of many stock CPU's with the FX-3850 maxing out at 196w draw under peak load (more than a stock 3960X and almost double the peak draw of a stock 3770K). This is of course well above what AMD specified the chip would do when giving motherboard manufacturers numbers to work to, thus anyone who didn't over engineer their board has a problem.
It seems to be that MSI under designs their motherboards. So,they are shifting the blame to everyone but themselves.
Not surprising that their previous AMD AND Intel motherboards have had VRM failures
So basically AMD said the CPU will use up to X power, but in fact it turns out to use X+Y power, and as MSI only engineered their board with a CPU using X power in mind its somehow their fault not AMD's, because they didn't over engineer their board?
A lot of manufacturers have had VRM issues over the years, IIRC Gigabyte had a VRM issue with their early X79 boards that resulted in them releasing a BIOS update to limit performance like MSI's example in the OP.
MSI chappy said:AMD has claimed that the FX-8350 to be 125W. However, during our internal testing, when the usage of CPU reaches 100% through Prime 95 for a while, the power consumption can exceed 125W and reaches 140W. With such condition on the 970A-G46, the high amount of power draw also causes the MOSFET to exceed its spec and will overheat.
The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).
In some cases the TDP has been underestimated such that in real applications (typically strenuous, such as video encoding or games) the CPU has exceeded the TDP. In this case, the CPU will either cause a system failure (a "therm-trip") or throttle its speed down.[1] Most modern CPUs will only cause a therm-trip on a catastrophic cooling failure such as a stuck fan or a loose heatsink.
For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used.
Since safety margins and the definition of what constitutes a real application vary among manufacturers, TDP values between different manufacturers cannot be accurately compared. While a processor with a TDP of 100 W will almost certainly use more power at full load than a processor with a 10 W TDP, it may or may not use more power than a processor from a different manufacturer that has a 90 W TDP. Additionally, TDPs are often specified for families of processors, with the low-end models usually using significantly less power than those at the high end of the family.
The dynamic power consumed by a switching circuit is approximately proportional to the square of the voltage:[2]
(where C is capacitance, f is frequency and V is voltage).
The Thermal Design Power (TDP) is the average maximum power a processor can dissipate while running commercially available software. TDP is primarily used as a guideline for manufacturers of thermal solutions (heatsinks/fans, etc) which tells them how much heat their solution should dissipate. TDP is not the maximum power the CPU may generate - there may be periods of time when the CPU dissipates more power than designed, in which case either the CPU temperature will rise closer to the maximum, or special CPU circuitry will activate and add idle cycles or reduce CPU frequency with the intent of reducing the amount of generated power.
TDP is usually 20% - 30% lower than the CPU maximum power dissipation.
Nope,its more a case of MSI consistently under-engineering their motherboards as they cost cut repeatedly.
So yes this is the fault of MSI and also,please explain to me the lack of consumer socket 2011 motherboards with 4+1 phase VRMs??
So,is that down to Intel giving wrong specifications to Gigabyte or rather Gigabyte making an error somewhere??
Also,125W is TDP,not power consumption. That is a thermal design parameter,not a power consumption parameter.
The chap does not known what power consumption and TDP is
Perhaps,MSI should have just rated the motherboard for a FX6300 instead?? If they rated it for 95W TDP CPUs,then it would mean less issues.
Problem sorted.
Under engineering and engineered to do what is required are not the same thing. Issues arising because MSI didn't over engineer the board are AMD's fault for understating what was required of the board.
Ahh no sorry, should have clarified that, the post referenced in the OP is just one of many and another one shows a report done by techreport on the peak draw of many stock CPU's with the FX-3850 maxing out at 196w draw under peak load (more than a stock 3960X and almost double the peak draw of a stock 3770K). This is of course well above what AMD specified the chip would do when giving motherboard manufacturers numbers to work to, thus anyone who didn't over engineer their board has a problem.
Again, no it isn't it's AMD's fault, and what does LGA2011 have to do with anything? :S
GB making an error, the point was MSI are not the only manufacturer to have VRM issues.
Addressed previously in the thread, its Chinese whispers due to the customer support guy relaying info from R&D.
Well if AMD hadn't given out incorrect specs for the FX-8350 to MSI then I'm sure MSI would have either designed the board for an FX-3850 or just rated it for an FX-6300...
No,because it appears you are adamant this is the fault of AMD.
So basically AMD said the CPU will use up to X power, but in fact it turns out to use X+Y power,
It makes me think even overclocking a 95W Athlon II X4 might cause the motherboard to have problems.
Do you really still not understand the difference between TDP and power usage? We've been through it enough times in this thread already, AMD are not stating that these CPUs are drawing 125w of electrical power.
In case people have become confused by all the cross talk of TDP and power draw in this thread, were not talking about a CPU that's rated at 125w TDP and consumes >125w power, that's a given, we're talking about a CPU that is officially rated and marketed as being 125w TDP yet is actually ≥140w TDP and consumes nearly 200w under full load.