I think CapTherm patented it before they showed their coolers at CES 2014 and CES 2015. As thermal siphon computer cooling has been around for years now with plenty of patents to be find by doing a simple google search.Great find. If you read the comments on that article, someone suggests that they were looking for someone to license the patents. Hopefully that has now happened.
Watched this earlier
Seems most talking heads don't know much. I much prefer written reviews.
Seems most talking heads don't know much. I much prefer written reviews.
Bump!
I've heard nothing since January. Does anyone have any info?
Maybe they're hitting to thing of diminishing cooling performance when making size and weight more reasonable?
Remember that "liquid metal" cooler from decade ago, which wasn't any better than normal heatpipe coolers, because heat dissipating area being the bottleneck, not heatpipes.
https://www.guru3d.com/articles_pages/danamics_lmx_superleggera_review,10.html
Their website says December, but I'm not holding my breath.Bump!
I've heard nothing since January. Does anyone have any info?
Assteclally it's ugly, looks like a metal box with a name on.