They have took on your suggestion with skylake for the 50 extra lol and forgot to add the rest of the suggestions. Although i'm under the impression it's difficult for them to solder the smaller dies now? I mean it can be done but i think the amount of waste e.g bad chips from trying to solder is a lot more than ones where they just apply thermal compounds. And its much cheaper for them to do this too which is why i assume they do it.
They need to change their warranty to allow for de lidding as long as there is not visible signs of damage to the chip when doing so.
Just like GPU AIBs which allow for cooler removal, if your careful its fine if you mess up it's your fault and warranty doesn't cover it. And i agree about IGP too, we don't need this. Id prefer to have a really cheap GPU as a backup if my main GPU goes POOF. Don't need that IGP in the k series chips.
